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Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution

Report type
Reverse Technology
Manufacturer
Reference
Peraso X710 CHipset
Device type
RF IC, SIP
Published
01/08/2018
Product Code
SP18418
Applications
Consumer
Available flyer Available sample

Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm WiGig Chipset Smartphone Edition
Device type
3D Packaging, RF IC
Published
03/07/2018
Product Code
SP18393
Applications
Consumer
Available flyer Available sample
RF Front-End Module Comparison 2018: 40 modules and components found in 10 flagship products

RF Front-End Module Comparison 2018

Report type
Reverse Technology
Manufacturer
Apple, Huawei, Samsung, SONY, Xiaomi
Reference
RFFE Module
Device type
RF IC
Published
17/04/2018
Product Code
SP18389
Applications
Consumer
Available flyer Available sample
Broadcom AFEM-8072: the first Mid and High Band Long Term Evolution (LTE) RF Front-End Module (FEM) in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging - System Plus Consulting

Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM)

Report type
Reverse Costing
Manufacturer
Broadcom
Reference
Broadcom AFEM-8072
Device type
RF IC
Published
27/02/2018
Product Code
SP18379
Applications
Consumer
Available flyer Available sample
SP18374 - Qualcomm QCA9500 60 GHz Chipset - System Plus Consulting

Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QCA9500 WiGig Chipset
Device type
3D Packaging, RF IC, SIP
Published
17/01/2018
Product Code
SP18374
Applications
Automotive Consumer Industrial
Available flyer Available sample
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