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DENSO SiC Power Module in Toyota Mirai II - Package Opening tilted – Optical View - System Plus Consulting

DENSO SiC Power Module in the Toyota Mirai II

Report type
Reverse Costing
Manufacturer
Denso
Reference
Device type
Published
15/12/2021
Product Code
SPR21627
Applications
Automotive & Mobility
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SiC Transistor Comparison 2021 - Package Opening – Die Topsides – Optical View - System Plus Consulting

SiC Transistor Comparison 2021

Report type
Reverse Costing
Manufacturer
Reference
Device type
Published
15/12/2021
Product Code
SPR21604
Applications
Automotive & Mobility Industrial Telecom & Infrastructure
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Discrete Power Device Packaging Comparison - Packaging design in descrete power devices - System Plus Consulting

Discrete Power Device Packaging Comparison 2021

Report type
Reverse Costing
Manufacturer
Infineon, Littelfuse, Microship, Nexperia, Nuvoton, ON Semiconductor, Rohm, STMicroelectronics, Taiwan Semiconductor, Texas Instrument, Toshiba, Vishay
Reference
Device type
Published
28/10/2021
Product Code
SPR21596
Applications
Automotive & Mobility Industrial
Flyer Sample
GeneSiC 1200V Gen3 and 3300V Gen2 SiC MOSFETs - Die Delayering - Optical View - System Plus Consulting

GeneSiC 1200V Gen3 and 3300V Gen2 SiC MOSFETs

Report type
Reverse Costing
Manufacturer
Genesic
Reference
Gen2 Gen3 SiC MOSFET
Device type
Published
17/08/2021
Product Code
SPR21621
Applications
Industrial Telecom & Infrastructure
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EPC2152 Half Bridge Monolithic GaN IC - GaN IC - System Plus Consulting

EPC2152 Half Bridge Monolithic GaN IC

Report type
Manufacturer
EPC Corporation
Reference
EPC2152
Device type
Published
04/02/2021
Product Code
SPR21554
Applications
Industrial Mobile & Consumer
Flyer Sample
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