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Articles / Press releases

System-in-Package, a success story

Extracted from : • System-in-Package (SiP) Technology and Market Trends 2020, Yole Développement, 2020 •...

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3D imaging and sensing: now it is rear 3D sensing turn to be the leading growing application

Extracted from : • 3D Imaging and Sensing, Yole Développement 2020 • CIS Quarterly Market...

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High-end CPU and GPU: HPC and cloud gaming are setting the bar for leadership

Extracted from : • (x)PU: high-end CPU and GPU for datacenter applications report, Yole Développement...

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EV/HEV are driving power module packaging innovations

Outlines: • The power module market will reach US$6 billion by 2024, with a 2018...

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GaN-on Si: many opportunities are driven by microLED, power electronics and RF electronics…

Outlines: • GaN-on-Si(1) IP(2) landscape: historical players stepping back, leading to a substantial reconfiguration of...

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