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Advanced Packaging & System Integration Technology Symposium – 2019


System Plus Consulting at Advanced Packaging & System Integration Technology Symposium 2019?

Romain Fraux, CEO at System Plus Consulting, will participate to this event; feel free to attend his presentation on April 23rd at 11:35am.

You are welcome to take this occasion to meet him onsite and:

  • Understand our cost methodology
  • Discuss about our costing tools (software)
  • Discover our last Reverse Costing reports
  • Get a full demo a one of our catalogue report


Where? Shangai, China

When? April 22 – 23, 2019

Why coming to Advanced Packaging & System Integration Technology Symposium 2019?

Advanced packaging: at the heart of innovation

Advanced packaging is driven by the wind of changes…
Be part of our Advanced Packaging & System Integration Technology Symposium!
For the 5th edition, NCAP and Yole Développement combine their expertise to build an innovative program dedicated to the advanced packaging industry – during one day and a half, meet the leading executives and gain an in-depth understanding of the market evolution!

It is a fact, Advanced packaging is at the heart of innovation. Mega-trend applications are bringing new challenges, and leading advanced packaging companies from all over the world will come to exchange ideas on their vision and future perspectives at the Advanced Packaging & System Integration Technology Symposium.

Yole Développement and NCAP have created an unprecedented program to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!

This year, the location will change, it will thus take place in Shanghai, China, from April 22PM to 23, 2019, prior to NEPCON China 2019.

During one day and a half, all packaging aspects, including Panel Level, Fan Out, System in Package, Advanced Substrates and 3D Technology, will be discussed. A focus on key applications such as AI, HPC, memory, transportation (48V, EV/HEV, embedded die packaging platform, PCB, advanced substrates…), 5G and consumer (WLP and Fan-Out platforms)… will be at the heart of the conference.

Gain an insight into a unique symposium…

  • 5 key industry focuses: AI/HPC, memory, transportation, 5G and consumer
  • About 20 inspiring presentations
  • Unique access to leading players and experts
  • A panel session to debate
  • Several networking times to discuss with your peers
  • Short courses to cover a broad range of topic areas at a variety of educational levels

Find more information on the event here.

– By Yole Développement and NCAP China –


If you want to know more, contact us to schedule a meeting:

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