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Most recent Reverse
Costing reports

  • pmd/Infineon’s 3D Indirect Time-of-Flight in LG G8 ThinQ

    World-first Front Facing 3D Indirect ToF camera in the LG G8 ThinQ smartphone, with NIR 3D Camera and flood illuminator.

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  • 200V EPC2112 eGaN® HEMT with Monolithic Optimized Gate Driver

    Discover the unique enhancement-mode gallium-nitride (eGaN®) transistor monolithically integrated with a gate driver from EPC.

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  • Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052

    A study from modem to antenna of the very first compact-form 5G millimeter-wave chipset for handset applications.

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  • Freebox Delta Server

    The latest Freebox Delta Server, supplied by Freebox, the French internet service provider, is the first modem/router compatible with the 10 Gbit/s FTTH 10G-EPON standard for general public use.

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  • Free Devialet Player

    The new Free Devialet Player is the first multimedia player using an audio system with six loudspeakers and SAM® technology for a 360° sound experience, and much more.

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Most recent Costing

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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  • European Microwave Week 2019

    September 29 to October 4, 2019 Paris, France

    System Plus Consulting at European Microwave Week – 2019 Stéphane Elisabeth, Expert Cost Analyst and…

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  • Inkjet Printhead Industry: Key Events Create New Momentum – Webcast

    Free Webcast – September 26, 2019 at 5 PM CET – 8 AM PDT What…

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New articles

  • Imaging technologies are transforming the automotive industry

    Extracted from: Imaging for Automotive 2019 report, Yole Développement, 2019 | ZF S-Cam 4 –…

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  • Memory business: applications are driving the long-term growth

    Extracted from: Status of the Memory Industry report, Yole Développement, 2019 / NAND Service –…

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  • Advanced substrates: the wind of change

    Extracted from: Status of Advanced Substrates report, Yole Développement, 2019 edition | Intel’s Embedded Multi-Die…

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