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3D Systems Summit

 

System Plus Consulting at 3D Systems Summit?

Romain Fraux, CEO at System Plus Consulting, will participate to this conference; feel free to attend his presentation: “From 2.5D/3D to SiP and FO-WLP: Overview of the latest advanced packaging platforms on the market”.

You are welcome to take this occasion to meet him onsite and:

  • Understand our cost methodology
  • Discuss about our costing tools (software)
  • Discover our last Reverse Costing reports
  • Get a full demo a one of our catalogue report

 

Where? in Dresden, Germany

When? January 28 – 30, 2019

Why coming to 3D Systems Summit?

From 3D technologies to Heterogeneous Integration and High-Density Systems for different applications.

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.

2019 MAIN TOPICS & HIGHLIGHTS 
3DIC Through-Silicon-Via (TSV) technology
2.5D, 3D FO-WLP/e-WLB
Active and passive interposers
Stacked dies or stacked wafers
3D alternative technologies
5G Integration
Invited speakers and Keynotes
Exhibition area
Networking opportunities

Find more information on the event here.

– By 3D Systems Summit –

 

If you want to know more, contact us to schedule a meeting: info@systemplus.fr.

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