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3D Packaging is breaking new ground – Webcast

3D Packaging is breaking new ground – Webcast

Free Webcast – December 3, 2020 at 5 PM CET – 8 AM PST

The replay and the materials are available with the same registration link during one year!

3D Packaging: A disruptor of the semiconductor supply chain.

With the increase in demand for cloud and edge computing, a high-level of performance is increasingly observed at end-system devices in datacenter storage, switching, networking, and High-Performance Computing (HPC) as well as in consumer devices, personal computing, and gaming. These are the key major trends driving the growth of the 2.5D/3D Packaging market.

Without doubt, the industry is seeking alternative ways to design & manufacture the latest SoCs using SiP and chiplet based approaches by leveraging different advanced packaging technologies and a mix of both latest & mature nodes. This demands 2.5D/3D integration of semiconductor components, addressable only by high-end performance packaging. In a slowing Moore’s Law environment, industry is now heavily reliant on high-end packaging breakthroughs to address the high-performance computing requirements by improving 2.5D/3D interconnect density and thus system-level functions.

In this webcast, Yole Développement and System Plus Consulting join forces to provide an understanding of today’s 2.5D/3D packaging market and its evolution. Based on Yole Développement’s analysis, the 2.5D/3D packaging market is expected to reach $4.3B by 2025 from $871M in 2019, with a CAGR of 30.5%. Giant players, such as Intel, TSMC and Samsung, have effectively tapped into the advanced packaging market’s growth with both FE and BE capabilities. They have achieved faster time-to-market than OSATs for high-end performance packaging, at an historically unprecedented scale. This strategy of the big players poses a direct, formidable threat to OSATs.

Meanwhile, System Plus Consulting will provide thorough cost and technical analyses of recent devices using 2.5D/3D integration technology. Join us for this important webcast and enrich your understanding of this field.

Finally, this webcast will help you to understand that within 2.5D/3D Packaging, the OSATs’ business is being cannibalized by foundries and IDMs. Moving forward, the fabless model may become more attractive thanks to cutting-edge turnkey services, such as the latest silicon node manufacturing technology coupled with advanced packaging. Fabless companies and design houses are looking to optimized packages for value-for-money, especially for high-end applications. If big players can provide both quality and cost benefits, then OSATs may have to remain defensive.

Where? Online

When? December 3rd, 2020 at 5 PM CET – 8 AM PST

Register Today

Speakers

Stéphane Elisabeth
Technology & Cost Analyst – System Plus Consulting

Stéphane Elisabeth, PhD has joined System Plus Consulting’s team in 2016. Stéphane is Expert Cost Analyst in RF, Sensors and Advanced Packaging. He has a deep knowledge of materials characterizations and electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics.

 

Favier Shoo
Technology & Market Analyst, Package Assembly and Substrate – Yole Développement

Favier Shoo is a Technology and Market Analyst in the Semiconductor & Software division at Yole Développement, part of Yole Group of Companies. Based in Singapore, Favier is engaged in the development of technology & market reports as well as the production of custom consulting reports.
During 7 years at Applied Materials as a Customer-Application-Technologist in the advanced packaging marketspace, Favier developed a deep understanding of the supply chain and core business values. As an acknowledged expert in this field, Favier has provided training and held numerous technical review sessions with industry players. In addition, he has obtained 2 patents.
Prior to that, Favier worked at REC Solar as a Manufacturing Engineer to maximize production capacity.
Favier holds a Bachelor in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang Technological University (NTU) (Singapore). Favier was also the co-founder of a startup company where he formulated business goals, revenue models and marketing plans.

 

More information: here

Contact Julie Robert – julie.robert@yole.fr

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