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3D European Summit 2016, powered by SEMI


Romain Fraux, MEMS & Advanced Packaging Project Manager from System Plus Consulting will present the latest 3D TSV technologies and compare the trends.

The conference takes place in Grenoble, from Jan. 18 – 20.

Discover the full program and register today on Feel free to visit Yole‘s booth in the exhibition area and ask for a meeting with Yole & System Plus Consulting experts during the conference.…

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