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Advanced Packaging & System Integration Technology Symposium

 

System Plus Consulting on Advanced Packaging & System Integration Technology Symposium

System Plus Consulting at Advanced Packaging & System Integration Technology Symposium?

Stéphane Elisabeth, Advanced Packaging, MEMS & RF Costing Engineer at System Plus Consulting, will present on “From Radar to Mobile Front-End Module – RF Packages Technology & Cost Review“, April 20 from 3:00AM to 3:25AM

You are welcome to take this occasion to meet our team and:

  • Understand our cost methodology
  • Discuss about our costing tools (software)
  • Discover our last Reverse Costing reports
  • Get a full demo a one of our catalogue report

Where? in Wuxi, China

When? April 20th– 21st, 2017

Why coming to Advanced Packaging & System Integration Technology Symposium?

For the 3rd time, Yole Développement & NCAP partner to organize the Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology.

This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic place in the field of advanced packaging: Wuxi, China.

Find more information on the event here.

– From Yole Développement & NCAP –

 

If you want to know more, contact us to schedule a meeting: info@systemplus.fr.

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