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Reports

Most recent Reverse
Costing reports

  • GaN-on-Sapphire HEMT Power IC by Power Integrations

    The unique device with GaN-on-Sapphire technology in Anker’s PowerPort Atom PD 1 wall charger.

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  • GaN-Based Wall Charger Comparison 2019

    The first wall-chargers based on GaN technology from RAVPower, Aukey, Made in Mind, and Anker.

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  • Qualcomm 3D Sonic Sensor Fingerprint

    The second generation of biometric ultrasonic fingerprint authentication, found in the Samsung Galaxy S10 and S10 plus.

    Read more
  • Melexis Far Infrared Thermal Sensor MLX90640

    Low-cost far infrared thermal sensor array for smart buildings and the Internet of Things.

    Read more
  • Infineon 600V CoolGaN Transistor Family

    The first GaN-on-Si HEMT transistor from the world leader in power electronic components is today in mass production.

    Read more
See all reports

Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools

Events

  • Executives Breakfast – Memory industry: What could happen in the future?

    August 6, 2019 Santa Clara, CA, USA

    System Plus Consulting at Executives Breakfast – Memory industry: What could happen in the future?…

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  • Flash Memory Summit – 2019

    August 6-8, 2019 Santa Clara, CA, USA

    System Plus Consulting at Flash Memory Summit – 2019 Belinda Dube, Semiconductor Cost Analyst at System Plus…

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New articles

  • Imaging technologies are transforming the automotive industry

    Extracted from: Imaging for Automotive 2019 report, Yole Développement, 2019 | ZF S-Cam 4 –…

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  • Memory business: applications are driving the long-term growth

    Extracted from: Status of the Memory Industry report, Yole Développement, 2019 / NAND Service –…

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  • Advanced substrates: the wind of change

    Extracted from: Status of Advanced Substrates report, Yole Développement, 2019 edition | Intel’s Embedded Multi-Die…

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See all news
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