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Reports

Most recent Reverse
Costing reports

  • Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode

    The first PrimePACK™ 2 product from Infineon implementing IGBT5 and .XT joining technology with copper wire bonding and sintered silver die attach.

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  • e-Bikes Computer Display Comparison 2019

    On-board computers are the link between the riders and their e-bikes, discover the manufacturers’ technical choices and the device manufacturing costs.

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  • Qorvo QM76018 RFFEM in the Apple iPhone Xr

    First mid/high-band front-end module from Qorvo in an Apple phone with advanced packaging.

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  • Murata Incredible High Performance (IHP) SAW Filter

    The first thin-film SAW filter for 2.4 GHz Wi-Fi smartphone front-ends.

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  • Wolfspeed All-SiC Module CAB450M12XM3

    Discover the XM3 conduction-optimized module from Wolfspeed implementing the latest packaging and 1200V SiC die generations.

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Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools

Events

  • International Wafer-Level Packaging Conference – IWLPC

    Oct. 22-24, 2019 San Jose, CA, USA

    System Plus Consulting at IWLPC Stéphane Elisabeth, Expert Cost Analyst at System Plus Consulting, will…

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  • Semicon Europa

    November 12-15, 2019 Munich, Germany

    System Plus Consulting at Semicon Europa – 2019 Elena Barbarini, Head of Department Devices and…

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New articles

  • Sept. 30, 2019

    Solid-state lighting sources: a business opportunity of US$32 billion in 2024

    Extracted from: – Status of the Solid-State Lighting Source Industry report – VCSELs – Market…

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  • Sept. 30, 2019

    5G: The battle still rages

    Extracted from: 5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 report…

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  • Sept. 26, 2019

    Q2 2019: Memory business is approaching the bottom

    Extracted from: Status of the Memory Industry report, Yole Développement, 2019 NAND Service – Memory…

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