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Reports

Most recent Reverse
Costing reports

  • Wolfspeed CAS325M12HM2 All-SiC 1200V Power Module

    The only All-SiC high-performance packaging module from Wolfspeed for industrial applications.

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  • Huawei Mate 20 Pro’s 3D Depth-Sensing System

    The complete system includes a  3D camera, flood illuminator, and DOT projector featuring a DOE.

    Read more
  • Mobile Camera Module Comparison 2019

    Physical analysis and cost comparison of seven leading flagship smartphone cameras: Apple iPhone X/XS/XR, Samsung Galaxy S9, Huawei Mate 20 Pro and P20 Pro, Xiaomi Mi8 Explorer Edition, Oppo Find X and Vivo X21UD.

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  • Advanced packaging technology in the Apple Watch Series 4’s System-in-Package

    Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.

    Read more
  • Honeywell HG1120CA50 9-axis MEMS Inertial Sensor

    The first high reliability and highly rugged 9-axis IMU for industrial applications from Honeywell.

    Read more
See all reports

Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

    Read more
  • Power Price+

    Costing tool for active power components & modules

    Read more
See all costing tools

Events

  • Webcast: Smelling out the air quality market!

    January 15, 2019 Online

    Free Webcast – Janurary 15, 2019 at 5 PM CEST – 8 AM PDT As…

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  • 3D Systems Summit

    January 29 - 30, 2019 Dresden, Germany

      System Plus Consulting at 3D Systems Summit? Romain Fraux, CEO at System Plus Consulting, will participate…

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New articles

  • Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

    Extracted from: Fan-Out Packaging: Technologies and Market Trends report, 2019 edition – Yole Développement |…

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  • Would Apple change the power GaN world?

    Extracted from: Power GaN: Epitaxy, Devices, Applications and Technology Trends report, Yole Développement | GaN…

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  • Fan Out Panel Level Packaging (FOPLP): Samsung is playing a strategic game…

    INTERVIEW: SEMCO for i-micronews.com / @Micronews e-newsletter

    Read more
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