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Reports

Most recent Reverse
Costing reports

  • SiC Diode Comparison 2020

    Comparison of the technology and cost of 11 SiC diodes from Infineon, Wolfspeed, Rohm, STMicroelectronics, ON Semiconductor, Microsemi, and UnitedSiC.

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  • Sensonor STIM318 Inertial Measurement Unit (IMU)

    Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.

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  • Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers

    Detailed technology and cost analysis of the high-end single-axis and dual-axis accelerometers integrated in the STIM318 IMU.

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  • Innoscience’s 650V GaN-on-Si Transistor

    The first 100% Chinese GaN-on-Si power device found in Rock’s fast charger, manufactured on an 8-inch platform.

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  • Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiD SKY78221

    First High-Volume Manufacturing (HVM) BAW filter on the market from Skyworks, integrated in the Apple iPhone 11 Pro Max and iPad Pro second generation.

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Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • LED CoSim+

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  • 3D-Package CoSim+

    Package manufacturing cost simulation tool

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Events

  • Optical Transceivers & Silicon Photonics Forum 2020

    Sept. 9 2020, PM Shenzhen, China

    September 9 2020, PM – Shenzhen, China Light communication is spreading everywhere!.   The first…

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  • Imaging & LiDAR for Automotive Forum 2020

    Sept. 10 2020, AM Shenzhen, China

    September 10 2020, AM – Shenzhen, China Get a clear view of key automotive vision…

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New articles

  • TF-SAW vs. BAW: RF companies set their objectives and make strategic choices

      Extracted from : • SAW Filter Comparison 2020 report, System Plus Consulting, 2020 •…

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  • Memory markets poised for major changes as COVID-19 weighs on demand

      Extracted from : • Status of the Memory Industry 2020 report Yole Développement, 2020…

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  • Under the Hood: A Tesla Model 3 Tear-Down After a Hardware Retrofit

      An article written by Junko Yoshida and Maurizio Di Paolo Emilio, for EETIMES, in…

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