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Reports

Most recent Reverse
Costing reports

  • ams’ Direct Time-of-Flight Detection SPAD-Based Proximity Sensor

    The first ams d-ToF proximity sensor based on Single Photon Avalanche Diode (SPAD) technology in the Huawei Mate 20 Pro.

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  • Analog Devices ADGM1304/1004: SP4T RF MEMS Switch

    Deep insight into the high performance RF MEMS switch dedicated to industrial applications.

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  • VCSEL in Smartphone – Comparison 2019

    Physical analysis and cost comparison of ten leading flagship smartphone VCSEL dies (dot projector, flood illuminator, and proximity sensor) from Apple, Huawei, Xiaomi, Oppo, Lenovo, and Intel.

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  • Mobile CMOS Image Sensor Comparison 2019

    Physical Analysis and Cost Comparison of 28 CMOS Image Sensors Found in Seven Leading Flagship Smartphone Cameras from Apple, Samsung, Huawei, Xiaomi, Oppo and Vivo.

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  • Intel Silicon Photonic 100G PSM4 QFSP28 Transceiver

    Deep analysis of the first silicon photonic die with Intel’s unique approach for laser integration, the outcome of 15 years of development, along with the main optoelectronic components in the connector.

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Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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Events

  • iMAPS ADVANCED SYSTEM IN PACKAGE (SiP) TECHNOLOGY 2019

    June 25-27, 2019 Monterey, CA - USA

    System Plus Consulting at iMAPS ADVANCED SYSTEM IN PACKAGE (SiP) TECHNOLOGY 2019? Romain Fraux, CEO at System…

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  • Advanced RF SiPs for Cellphones – Webcast

    Free Webcast – April 18, 2019 at 9 AM CET – 3 PM UTC +8…

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New articles

  • Advanced Packaging: game-changer for semiconductor revolution

    Advanced Packaging & System Integration Technology Symposium – April 22&23 – Shanghai, China Source: Fan-out…

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  • LiDAR industry: high expectations for autonomous driving

    Extracted from: LiDAR for Automotive & Industrial Applications report and Radar & Wireless for Automotive:…

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  • The 5G revolution is pushing innovations for RF front-end SiP

    Extracted from: Advanced RF System-in-Package for Cellphones, Yole Développement, 2019 – Broadcom AFEM-8092 System-in-Package in…

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