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Reports

Most recent Reverse
Costing reports

  • Exynos 9110: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)

    The first ultra-small multi-chip High Volume Manufacturing (HVM) FO-PLP device for consumer applications found in the Samsung Galaxy Watch

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  • Aptiv’s Third Generation of 77 GHz-Based Short-Range Radar (SRR3)

    The first highly integrated 77 GHz short range radar sensor for advanced driver assistance systems with a single receive-transmit MMIC bare die from Infineon found on the market.

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  • Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

    First consumer application in the Intel Core 8th Generation i7-8809G, the world’s first On-Package CPU and GPU with High Bandwidth Memory.

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  • Mitsubishi J1- Series 650V High-Power Modules for Automotive

    The first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.

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  • Miniaturized Gas Sensor Comparison 2018

    Comparison of four gas sensors for consumer applications made by Bosch, ams and Sensirion.

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Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools

Events

  • IWLPC – International Wafer-Level Packaging Conference 2018

    October 23 - 25, 2018

    System Plus Consulting at International Wafer-Level Packaging Conference 2018? Dr. Stéphane Elisabeth, Project Manager at…

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  • SEMICON Europa

    System Plus Consulting at SEMICON Europa? Elena Barbarini, Head of Department Devices at System Plus…

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New articles

  • Radar for automotive: we are entering a new age…

    Extracted from: Radar Technologies for Automotive report, 2017 edition and LiDAR for Automotive & Industrial…

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  • Power module packaging: latest innovations are driven by EV/HEV and WBG technologies

    Extracted from: Power Module Packaging 2018: Material Market & Technology Trends report, Yole Développement –…

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  • 2018, a new year for RF FE module market

    Press Release by System Plus Consulting, Knowmade & Yole Développement, July 2018

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