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Most recent Reverse
Costing reports

  • Ainstein K-77 Long Range Radar featuring Calterah CAL77A2T4R FOWLP Transceiver

    A next-generation mid- and long-range, wideband and high-resolution radar sensor for ADAS based on RF CMOS technology using eWLB packaging.

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  • Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Edition

    The first introduction of Mantis Vision’s technology into a mobile application, featuring coded structured light.

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  • Leading-edge 3D NAND Memory Comparison 2018

    A deep technology analysis and cost comparison report on cutting edge 3D NAND memory chips from Toshiba/SanDisk, Samsung, SK Hynix and Intel/Micron.

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  • Orbbec’s Front 3D Depth Sensing System in the Oppo Find X

    The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.

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  • Wafer to Wafer Permanent Bonding Comparison 2018

    Wafer bonding structure, process and cost analysis for CMOS image sensors, inertial, pressure and radio-frequency MEMS devices and LEDs.

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Most recent Costing

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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  • Webcast: Smelling out the air quality market!

    January 15, 2019 Online

    Free Webcast – Janurary 15, 2019 at 5 PM CEST – 8 AM PDT As…

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  • 3D Systems Summit

    January 29 - 30, 2019 Dresden, Germany

      System Plus Consulting at 3D Systems Summit? Romain Fraux, CEO at System Plus Consulting, will participate…

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New articles

  • Would Apple change the power GaN world?

    Extracted from: Power GaN: Epitaxy, Devices, Applications and Technology Trends report, Yole Développement | GaN…

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  • Fan Out Panel Level Packaging (FOPLP): Samsung is playing a strategic game…

    INTERVIEW: SEMCO for / @Micronews e-newsletter

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  • STMicroelectronics confirms its commitment to the power GaN industry

    INTERVIEW: STMICROELECTRONICS for / @Micronews e-newsletter

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