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Most recent Reverse
Costing reports

  • TDK-Chirp Ultrasonic Time of Flight Sensor

    The first Piezoelectric Micromachined Ultra-sonic Transducer (PMUT) millimeter-accurate ultra-low power Time of Flight sensor.

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  • Consumer MEMS Microphones Comparison 2020

    Compare the technology and cost of 19 microphones from Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper.

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  • Audi-Bosch FPK Generation 2 Instrument Cluster

    Latest Audi Q3 instrument cluster with immobilizer: Structural and cost analysis

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  • Sony’s 3D Time-of-Flight Sensing Solution in the Huawei P30 pro

    Deep analysis of the rear 3D sensing module with Sony’s CIS and Lumentum’s flood illuminator.

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  • Fan-Out Packaging Processes Comparison 2020

    In-depth technical and cost overview of key Fan-Out process technologies form Infineon, nepes, TSMC, SEMCO and ASE.

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Most recent Costing

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools


  • CS PIC SSI International Conference 2020

    Mar. 31 - Apr. 1, 2020 Brussels, Belgium

    Sylvain Hallereau and Taha Ayari, Technology & Cost Analysts at System Plus Consulting, will be…

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  • ADAS Sensors 2020

    April 1-2, 2020 Detroit, USA

    Wilfried Theron, Head of System Department at System Plus Consulting, will be attending this conference….

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New articles

  • System-in-Package, a success story

    Extracted from : • System-in-Package (SiP) Technology and Market Trends 2020, Yole Développement, 2020 •…

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  • 3D imaging and sensing: now it is rear 3D sensing turn to be the leading growing application

    Extracted from : • 3D Imaging and Sensing, Yole Développement 2020 • CIS Quarterly Market…

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  • High-end CPU and GPU: HPC and cloud gaming are setting the bar for leadership

    Extracted from : • (x)PU: high-end CPU and GPU for datacenter applications report, Yole Développement…

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