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Most recent Reverse
Costing reports

  • Intel Silicon Photonic 100G PSM4 QFSP28 Transceiver

    Deep analysis of the first silicon photonic die with Intel’s unique approach for laser integration, the outcome of 15 years of development, along with the main optoelectronic components in the connector.

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  • Sony’s 3D Time-of-Flight Depth Sensing Camera Module

    Deep analysis of the Sony’s 3D ToF Sensor and the VCSEL in the Oppo RX17 Pro.

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  • ABB LinPak 1700V 2x1000A Power Module

    The unique LinPak 1700V power module from ABB for industrial applications has an innovative, fast and rugged SPT++ chipset.

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  • Valeo SCALA Laser Scanner

    The world’s first automotive-grade LiDAR sensor for automated and autonomous driving.

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  • Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series

    Second generation of mid/high band Front-End module with advanced and innovative packaging.

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Most recent Costing

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools


  • Advanced Packaging & System Integration Technology Symposium – 2019

    April 22-23, 2019 Shangai, China

      System Plus Consulting at Advanced Packaging & System Integration Technology Symposium 2019? Romain Fraux, CEO at…

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  • PCIM Europe 2019

    May 7-9, 2019 Nuremberg, Germany

      System Plus Consulting at PCIM Europe 2019? Elena Barbarini, Head of Department Devices at System Plus…

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New articles

  • The camera module industry, a dynamic and innovative ecosystem

    Extracted from: Status of the Camera Module Industry – Focus on Wafer Level Optics, Yole…

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  • High performance computing, artificial intelligence and datacenter: the 2.5D & 3D stacking technologies playground

    Extracted from: 2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates report, 2019…

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  • Fan-Out is becoming imperative to stay competitive within the advanced packaging industry

    Extracted from: Fan-Out Packaging: Technologies and Market Trends report, 2019 edition – Yole Développement |…

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