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PACKAGING 3D Packaging

Qualcomm Snapdragon 820 MCeP Pop Embedded die System Plus Consulting

Qualcomm Snapdragon 820 & Samsung Exynos 8 PoP

Published
14/06/2016
Product code
SP16276
Price
EUR 3 790
Applications
Consumer
Available sample Available flyer Ask for info

Qualcomm has gained more than 100 design wins in multiple applications, including automotive and smartphone, for its high-end model, the Snapdragon 820. The Snapdragon shares Samsung’s latest flagship with the in-house Samsung Exynos 8 worldwide. Depending on the region, the Galaxy S7 integrates the Exynos 8 with classic Package-on-Package (PoP) packaging or the Snapdragon 820, with Molded Core Embedded Package (MCeP) technology, developed by Shinko, and embedded trace route substrate.

Located under the DRAM chip on the main board, the two processors are packaged using PoP technology. The international version features an Exynos chipset while the US and Eastern Asia versions feature the Snapdragon 820 chipset.

The Qualcomm Snapdragon 820 is an embedded die package with Shinko’s packaging technology, using Copper Core Solder ball to replace the well-known Through Molded Via (TMV) technology. In the previous generation of the 800 series Qualcomm used Shinko’s MCeP packaging. In this report, we will show the differences and the innovations of this package, including copper pillar flip-chip and a coreless substrate with embedded trace substrate technology. The detailed comparison with the Exynos 8 will give the pros and the cons of the MCeP technology compared to standard PoP.

Thanks to this MCeP process, Qualcomm is able to offer a very thin PoP with a high number of I/O pads. The result is a very cost-effective component that can compete with a standard PoP. The report compares the costs of the different approaches.

This report also includes a technical comparison with the previous Qualcomm CPU, the Snapdragon 810 and the previous Samsung CPU, the Exynos 7.

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Overview / Introduction

Company Profile and Supply Chain

Physical Analysis

  • Physical Analysis Methodology
  • Samsung Galaxy S7 Disassembly (European & US)
    • Snapdragon 820 die removal
    • Exynos 8 die removal
  • Snapdragon 820 MCeP Packaging Analysis
    • Package view and dimensions
    • Package opening
    • Package cross-section
  • Exynos 8 PoP Packaging Analysis
    • Package view and dimensions
    • Package opening
    • Package cross-section
  • PoP Comparison
  • Snapdragon 820 Die Analysis
    • Die view and dimensions
    • Die cross-section
    • Die process
  • Exynos 8 Die Analysis
    • Die view and dimensions
    • Die cross-section
    • Die process
  • Comparison with Previous Generation (Snapdragon 810 & Exynos 7)

Manufacturing Process Flow

  • Chip Fabrication Unit
  • Packaging Fabrication Unit
  • MCeP Package Process Flow

Cost Analysis (Snapdragon/Exynos)

  • Synthesis of the Cost Analysis
  • Supply Chain Description
  • Yield Hypotheses
  • Die Cost Analysis
    • Wafer cost
    • Die cost
  • Package Cost Analysis
  • Final Test Cost
  • Components Cost (Snapdragon/Exynos)

Estimated Price Analysis

Cost and price comparison with Samsung Exynos 8 PoP

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