Follow us :

fren

MEMS Pressure sensor

MEMS Pressure Sensor: Structure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications 2018

MEMS Pressure Sensor Comparison 2018

Published
30/05/2018
Product code
SP18395
Price
EUR 4 990
Applications
Automotive Consumer Industrial
Available sample Available flyer Ask for info

Structure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications.

MEMS Pressure Sensor: Structure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications 2018

 

The MEMS pressure sensor market is still driven by automotive applications, but the consumer market has advanced to second place. That’s according to Yole Développement’s MEMS Pressure Sensor Market and Technologies 2018 report. To complement it, System Plus Consulting has conducted a unique comparative review. We provide insights into the structures, technical choices, designs, processes, supply chain positions and costs of seven consumer, 14 industrial and 13 automotive MEMS pressure sensor products from the leading suppliers. The suppliers include All Sensors, Amphenol, APM, Bosch, Denso, First Sensor, Fuji Electric, Freescale, Honeywell, Infineon, Melexis, Merit SensorSystems, Mitsubishi Electric, Nagano Keiki, Sensata, Sensirion, SMI and STMicroelectronics.

We analyze and compare 34 devices that use piezoresistive or capacitive technology, manufactured with bulk micromachining or surface micromachining processes, first level packaging or module packaging, monolithic or multi-chip structures. We look at their package dimensions and internal structures, MEMS and application specific integrated circuit (ASIC) dies, die dimensions and package cross-sections, to provide a comprehensive review of MEMS pressure sensors.

MEMS pressure devices’ packaging and pressure range differ widely according to application. In more than 150 pages, this report includes multiple comparisons based on physical analyses of 34 MEMS pressure sensor components. It offers buyers and device manufacturers the unique possibility of understanding MEMS pressure sensor technology evolution, and comparing product costs.

 

MEMS Pressure Sensor: Structure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications 2018 MEMS Pressure Sensor: Structure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications 2018 MEMS Pressure Sensor: Structure and costing comparison of 34 MEMS pressure sensors from 18 different manufacturers in consumer, automotive and industrial applications 2018

 


 

ASSOCIATED REPORT

Power Module Packaging 2018: Material Market and Technology Trends – by Yole Développement

Power packaging is continuously adapting to power application market trends.

Bundle offer possible with the MEMS Pressure Sensor Comparison 2018 Report by System Plus Consulting, contact us for more information.

KEY FEATURES OF THE REPORT:

  • Presentation of thermomechanical issues in power modules
  • 2017-2023 market value for the power electronics field and especially for power modules
  • Complete analysis of power module packaging design
  • Deep insight into each part of a standard power module package: substrate, baseplate, die attach, substrate attach, encapsulation and interconnections
  • Technology trends and roadmaps
  • Detailed analysis of thermal interface materials (TIMs)
  • Presentation of case studies and technological innovations
  • 2017-2023 market metrics and forecasts for each type of packaging component covering substrate, baseplate, die attach, substrate attach, encapsulation, interconnections and TIMs
  • Evolution of different business models among the packaging material suppliers ecosystem
  • Supply chain analysis and evolution trends
  • Complete presentation of Wide Band Gap device packaging
  • Conclusion on the packaging trends for the coming years

Get more here

 

Back to top

Overview / Introduction

  • Executive Summary
  • Devices Analyzed
  • Reverse Costing Methodology

Structure, Process and Cost Review

  • Consumer
    • Bosch
    • Infineon
    • InvenSense
    • STMicroelectronics
  • Industrial
    • All Sensors
    • Amphenol
    • First Sensor
    • Fuji electric
    • Honeywell
    • Merit Sensor Systems
    • Nagano Keiki
    • Sensirion
    • SMI
  • Automotive
    • APM
    • Bosch
    • Denso
    • Fuji Denki
    • Infineon
    • Mitsubishi
    • Sensata
Back to top
© Copyright 2018 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Disclaimer l Term of use l Privacy policy l Webmaster