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MEMS Microphone

iPhone 5 MEMS Microphones AAC

Published
10/09/2013
Product code
SP13139
Price
EUR 2 490
Applications
Consumer
Available sample Available flyer Ask for info

Apple initiated the trend of integrating three MEMS microphones with the iPhone 5. Two manufacturers compete to integrate their analog microphones, Knowles which largely dominates the MEMS microphone market (with half of the business) and AAC which is ranked No. 2 but is the main source for the iPhone5.

Both components are interchangeable in the iPhone 5, thus providing similar package/functionalities/price but with two different processes. The two reports are available separately but you can benefit from our special bundle offer buying both of them.

AAC Technologies continues to rely on Infineon for the production and design of the MEMS die, but compared to the ones integrated in the previous iPhone the new design integrates corrugations in the membrane allowing to relieve stress under maximum strain.

The MEMS Microphone uses a free-floating diaphragm.

The common sensing principle is capacitive.

The component is provided in a specific 3-pins package, compatible with SMD process.

This report provides a complete teardown of the MEMS microphones with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation
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Glossary

 Overview/Introduction

 Companies Profile

 iPhone 5 Teardown

 Physical Analysis

  •  Physical Analysis Methodology
  •  Package
    • Package Views & Dimensions
    • Package Opening
    • Package Cross-Section
  •  ASIC
    • View & Dimensions
    • Marking
    • Process
    • Cross-Section
    • Process Characteristics
  •  MEMS
    • View & Dimensions
    • Marking
    • Dicing
    • Bond Pads
    • Diaphragm & Backplate
    • Cross-Section

Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

 Cost Analysis

  •  Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer Cost
  • ASIC Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Front-End: Equipment Cost per Family
  • MEMS Front-End: Material Cost per Family
  • MEMS Wafer Cost
  • MEMS Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • Microphone Component Cost & Price
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