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MEMS Environment

Bosch BME680 world's first environmental sensor combining gas, pressure, humidity and temperature in a 3mm x 3mm footprint package - System Plus Consulting

Bosch BME680 Environmental Sensor with Integrated Gas Sensor

Published
19/07/2017
Product code
SP17342
Price
EUR 3 490
Applications
Consumer
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The market for environmental MEMS is set to grow at a Compound Annual Growth Rate of 16% between 2017 and 2022. In 2016, it was worth $65 million and is due to reach $148 million in 2022, according to Yole Développement.

Bosch’s BME680 environmental sensor is the evolution of its BME280 environmental sensor, adding gas sensor functionality. Assembled in an 8-pin, metal-lid 3.0mm x 3.0mm x 0.95mm land grid array package, this System-in-Package (SiP) integrates a digital humidity, pressure, temperature sensor and a separate gas sensor. It is equipped with only two MEMS dies and an amplification application-specific integrated circuit, the same number of dies as the previous BME280 device, but with an additional feature. Bosch has integrated humidity, pressure and temperature sensors on one single MEMS die, using a new technology for the humidity sensor. The BME680 can detect a broad range of gases, including volatile organic compounds, using a smaller gas sensor die compared to competitors like ams.

This ‘combo’ sensor shows Bosch’s control of sensor integration, with technologies 100% internally developed and manufactured. The MEMS pressure sensor is manufactured with Bosch’s Advanced Porous Silicon Membrane process, integrating the flexible pressure membrane and temperature diodes on a silicon substrate with the humidity sensor.

The device is a real SiP, with a combination of four sensors in one small package, mixing wire bonding and flip-chip connections. An exhaustive package analysis is performed in the report.

The report includes deep technological and cost analyses of the BME680, and a technical comparison with Bosch’s environmental sensors, the BMP280 and BME280 devices. Also, it features a comparison with the ams/Cambridge CMOS Sensors gas sensor.

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Overview / Introduction

Company Profile

  • Bosch Sensortec
  • BME680 Characteristics

Physical Analysis

  • Package
    • Package views, dimensions and pin out
    • Package opening
    • Package cross-section
  • ASIC
    • View, dimensions and marking
    • Delayering
    • Main blocks identification
    • Process identification
    • Cross-section
    • Process characteristics
  • MEMS Humidity and Pressure
    • View, dimensions and marking, sensing area details, cross-section, process characteristics
  • MEMS Gas Sensor
    • View, dimensions and marking, sensing area details, cross-section, process characteristics

Bosch Environmental Sensor Evolution and Comparison

Manufacturing Process Flow

  • Overview
  • ASIC Process Flow/Fab Unit
  • MEMS Humidity and Pressure Process Flow/Fab Unit
  • MEMS Gas Sensor Process Flow/Fab Unit
  • Packaging Process Flow and Assembly Unit

Cost Analysis

  • Summary of the Cost Analysis
  • Main Steps of the Economic Analysis
  • Yield Hypotheses
  • ASIC
    • ASIC front-end cost and die cost
  • MEMS Pressure and Humidity
    • MEMS front-end cost, front-end cost per process step, probe test and dicing cost, wafer and die cost
  • MEMS Gas Sensor
    • MEMS front-end cost, front-end cost per process step, probe test and dicing cost, wafer and die cost
  • Packaging Cost
    • Back-end: final test and calibration cost
    • BME680 component cost

Estimated Price Analysis

  • Manufacturer Financial Ratios
  • Estimated Selling Price
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