Technology, Process and Cost
Heimann Sensor 32 x 32-Array Thermopile LWIR Image Sensor with Silicon Lens
By Yole SystemPlus —
A small, easy to use, low-power, cheap non-contact temperature measurement for varying applications
LWIR imaging is increasingly used in myriad applications, from consumer to industrial. Low-cost, large arrays (32 x 32 and more) are specifically adapted to smart home/smart building applications for occupant detection, popu-lation localization, population counting, fire detection, and more. For these large markets of many hundreds of millions units a year, thermopile sensors are cost-competitive compared to micro-bolometers.
Based on a low-definition, 32 x 32 thermopile sensor, Heimann Sensor’s HTPA32x32d is dedicated to these markets. Cheaper than a microbolometer and easier to integrate, the thermopile offers very good performance for applications that do not require high-resolution images and a high frame rate.
The thermopile array sensor consists only of a 0.5cm³ camera (with lens). The system is made easy for integrators with a digital I²C interface, and includes for the first time a silicon lens for low-cost applications. The 32 x 32 array sensor uses a 90µm pixel based on a thermopile technology for a very compact design.
This report provides a detailed teardown and cost analysis of the thermopile die, the silicon lens, the EEPROM die, and the packaging.
This report also includes a comparison between the characteristics of the new and previous versions of the thermopile sensors from Heimann Sensor, and a comparison with FLIR’s ISC1403 microbolometer. This latter comparison highlights differences in each company’s technical choices.
REVERSE COSTING WITH
- Detailed photos
- Precise measurements
- Materials analysis
- Comparison between Heimann Sensor and Flir Microbolometer
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated sales price
Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
Company Profile
- Heimann Sensor
Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package
- Package views, dimensions and marking
- Package opening
- Silicon Lens
- View, dimensions
- Cross-section and lens coating
- EERPOM Die
- Thermopile Die
- View, dimensions and marking
- Pixels, thermocouples
- Cross-section
- ROIC characteristics
- Process characteristics
Comparison – Heimann Sensor HTPA32x32d vs. Flir ISC1403L
Manufacturing Process Flow
- Global Overview
- EEPROM Front-End Process and Wafer Fabrication Unit
- ROIC Front-End Process and Wafer Fabrication Unit
- Thermopile Front-End Process and Wafer Fabrication Unit
- Thermopile Back-End 0: Probe Test and Dicing
- Silicon Lens Front-End Process
- Back-End – Final Test
Cost Analysis
- Synthesis of the Cost Analysis
- Yields Explanation and Hypotheses
- EEPROM die – front-end cost + Wafer and die cost
- Silicon lens – front-end cost + Wafer and die cost
- Thermopile die – front-end cost + wafer and die cost
- Component
- Back-end – packaging cost
- Back-end – final test cost
- Component cost
Estimated Price Analysis