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Orbotech’s SPTS Technologies accelerates industry adoption of its Mosaic™ Plasma Dicing Solution with order from JCAP

Press Release by Orbotech’s SPTS, March 2017

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Industry adoption of SPTS’s Plasma Dicing Solution further verified by System Plus Consulting ‘Teardown’ analysis of MEMS microphones in iPhone 7 Plus.

 

ORBOTECH announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic™ Plasma Dicing System from JCAP (Jiangyin Changdian Advanced Packaging), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech’s SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting1 confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.

 

Commenting on this recent order, Kevin Crofton, Corporate Vice President at Orbotech and President of SPTS Technologies, said: “JCAP selected Orbotech’s SPTS plasma dicing solution over competing options because the Mosaic system demonstrated superior results and offers lower cost of ownership. We were also selected for our inclusive approach and willingness to work alongside other suppliers in the back-end space to produce sustainable process flows.

 

Mr. Crofton continued, “The Mosaic platform configured with the Rapier-300S is designed for handling 400mm framed wafers in a high volume manufacturing environment. It allows customers to offer industry-leading plasma dicing services that will meet the packaging needs of next generation devices. By adding plasma dicing to their service portfolio, customers can provide higher value packaging services and gain improved profitability in a highly cost sensitive industry.”

 

According to Amandine Pizzagalli, Technology & Market Analyst, at Yole Développement and author of the report entitled “Thin Wafer Processing and Dicing Equipment Market”, “Plasma dicing could reshape the dicing industry landscape by increasing the number of chips per wafer and thus reducing the cost of ownership of the dicing process. Driven by the rising demand for thinner wafers and stronger die, plasma dicing is positioned to become the only viable dicing option for next generation ultra small, ultra thin and fragile devices such as RFID, MEMS, and Power devices.”

 

 

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