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MEMS MedTech

Thermo Fisher Ion 520 DNA Sequencing Chip

Publié
28/07/2017
Code produit
SP17346
Prix
3490 EUR
Applications
Industriel Médical
Extrait disponible Brochure disponible Demande d'info

Today a main challenge in life science research is to reduce the price of genomic analysis, and the time taken to do it. Back in 2003, the cost of sequencing the human genome was almost $3B. That decreased to $10,000 in 2011, and is headed towards $1,000 in the next few years. Thermo Fisher, with 8% of the microfluidic product market, is one of the companies most involved in sequencing applications, along with its rival Illumina. However, the two companies have different objectives. Thermo Fisher intends to reduce analysis time with fast throughput and short single-end reads. Illumina has high throughput with short paired reads. To deliver fast reading, Thermo Fisher uses Ion Torrent® technology, which relies on technology similar to an image sensor.

The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It includes a multiwell array, which captures the sphere particles that have DNA attached. The particles react with a solution of nucleotides, which changes the charge in the wells, which in turn is detected by the circuit and allows the DNA sequencing. With several materials involved in the chip manufacturing, 3D silicon design, polymers for microfluidic processing and its special assembly, the component appears to have a very high level of complexity.

Using Ion Torrent technology, Thermo Fisher has managed to provide a powerful and cost-effective sensor chip. The process is entirely CMOS compatible. Surprisingly, it uses well-proven standard packaging with a proprietary flow chamber design.

This report includes a complete analysis of the Ion 520 chip from Thermo Fisher, featuring chip disassembly and die analyses, processes and cross-sections. Finally, it contains a full cost analysis and a selling price estimation of the component.

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Overview/Introduction

Company Profile and Supply Chain

Physical Analysis

  • Physical Analysis Methodology
  • Package Analysis
    • View and Dimensions
    • Opening
    • Cross-section: PCB Substrate, Flow Cell Member
  • Die Analysis
    • Die View and Dimensions: Flow Chamber, Pixels
    • Die Active Area View and Delayering
    • Die Process
    • Die Cross-Section: Metal Layers, Wells, ISFET

Manufacturing Process Flow

  • Wafer Fabrication Unit
  • Packaging Process Flow

Cost Analysis

  • Overview of the Cost Analysis
  • Supply Chain Description
  • Yield Hypotheses
  • Wafer Cost Analyses:
    • Front-end Cost
    • Die Cost
  • Packaging Cost Analysis
    • Packaging Back-End Cost
    • Packaging Cost by Process Step
  • Component Cost

Estimated Price Analysis

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