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NanoLambda NSP32-V1 Nano Spectrometer

Publié
15/06/2017
Code produit
SP17334
Prix
3 490 EUR
Applications
Grand public Industriel Médical
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The NSP32-V1 from NanoLambda is the world’s smallest optical spectrometer, and the first such device for Internet-of-Things and handheld devices. It could enable everyday analysis of food and water, color measurement, health monitoring and pollution detection. The data measured by the NSP32-V1 is the same output format as conventional optical spectrum analyzers, which facilitates the use of this device without creating a new database.

The NSP32-V1 spectrometer uses a 1024 pixel, 32 x 32, nano-optical filter array to measure the light spectrum, based on a technological breakthrough, the plasmonic filter. This is a metal film perforated with subwavelength hole arrays. It is manufactured within the metal layer of the silicon die, giving a monolithic solution.

The 100μm-high sensor die is assembled in an advanced ball grid array (BGA) package with an optical window for only 500μm height. The other optical parts, the lens and the diffuser, are assembled in a 5.7mm-high module. The module is very small overall, at just 6mm x 6mm x 5.3mm.

Based on a complete teardown analysis of the NSP32-V1 nano-spectrometer, the report provides a complete physical analysis and manufacturing cost estimate of the die and the packaging, including the lens module.

The report also includes a comparison between the characteristics of the NSP32-V1 and the SCIO molecular sensor from Consumer Physics. The comparison highlights differences in technical choices made by the companies and their impacts on the process flow and manufacturing cost.

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Overview / Introduction

Company Profile

Physical Analysis

  • Physical analysis methodology
  • Spectrometer Module
    • Module views and dimensions, cross-section and disassembly
    • Top package disassembly and cross-section: window, diffuser, reflector
  • Spectrometer Die
    • Die view, dimensions and marking
    • Nano-optical filter array
    • Filter array view and dimensions
    • Photodiode
    • Filter cross-section
    • Pads and pixels
    • Die main block ID, process and cross section
    • Process characteristics
  • Physical Comparison
    • Die view, dimensions and marking

Manufacturing Process Flow

  • Overview of the Spectrometer Head
  • Sensor Front-End Process Flow
  • Sensor Wafer Fabrication Unit
  • Package and Module Assembly Process
  • Package Assembly Unit

Cost Analysis

  • Overview of the Cost Analysis
  • Yield Explanations and Hypotheses
  • Sensor
    • Sensor front-end cost
    • Sensor back-end 0: probe Test, thinning and dicing
    • Sensor wafer and die cost
    • Package cost
    • Module cost
  • Component
    • Spectrometer component cost

Estimated Price Analysis

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