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InvenSense ICM-30630

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3 490 EUR
Grand public
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With the emergence of connected objects and wearable devices like the personal fitness coach, InvenSense offers in the ICM-30630  a competitive, complete motion-tracking solution.

The ICM-30630 is the latest version of InvenSense’s 6-axis device (3-axis gyroscope + 3-axis accelerometer), based on the same technology used in smartphones like the Apple iPhone, with a MCU included in the package. Compared with the stand-alone sensor hub, this approach eliminates a package and reduces system-level power.

In competition with Bosch Sensortec and STMicroelectronics, InvenSense provides a low-power, highly programmable device for consumer electronics.

ICM-30360 MEMS sensors are fabricated with a low number of masks and are directly assembled on the ASIC by eutectic bonding. The device is shipped in a 3x3x1mm LGA package whose footprint is the same as the previous generation IMU.

Using knowledge obtained from previous acquisitions, InvenSense was able to design its own MCU, which provides a fully open platform.

This report also features a detailed technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense’s incredibly smart design.

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Overview / Introduction

InvenSense Company Profile

Physical analysis

  • Package
    • Package characteristics: view, dimensions, and opening
    • Package cross-section
  • MEMS Die
    • View, dimensions, and markings
    • MEMS sensing area: technical description
    • MEMS cap removed
    • ASIC delayering and process
    • Die cross-section: ASIC
    • Die cross-section: MEMS cap and sensor
  • MCU Die
    • View, dimensions, and markings
    • Delayering and main block ID
    • Process and die cross-section
    • Die process characteristics

Manufacturing Process Flow

  • Global overview
  • ASIC & MCU front-end process
  • MEMS process flow
  • ASIC & MCU wafer fabrication unit
  • Packaging process flow and assembly unit

Cost Analysis

  • Main steps of economic analysis
  • Yields hypotheses
  • ASIC front-end cost
  • MEMS front-end cost
  • ASIC/MEMS assembly cost
  • MEMS front-end cost per process steps
  • Total front-end cost
  • Back-end 0: probe test and dicing
  • Wafer and die cost
  • MCU front-end and back-end 0 cost
  • MCU die cost
  • Back-end: packaging cost
  • Back-end: packaging cost per process steps
  • Back-end: final test cost
  • Component cost and price

Cost & price comparison with Bosch Sensortec 9-Axis Sensor Hub BMF055 

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