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MEMS IMU/Combo

Bosch SMI130

Publié
24/03/2015
Code produit
SP15215
Prix
2 990 EUR
Applications
Extrait disponible Brochure disponible Demande d'info

MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.

The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5×3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ±125°/s and ±2000°/s; the acceleration sensor offers four different measurement ranges between ±2g and ±16g.

The gyro integrates a new process for the capping. Indeed, the classic « glass-frit » wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.

The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.

The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.

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Glossary

Overview/Introduction , Bosch Company Profile

Physical Analysis

  • Package
    • Package Views & Dimensions
    • Package Opening
    • Wire bonding Proces
    • Package Cross-Section
  • ASIC Gyro & Accelero Dies
    • View, Dimensions & Marking
    • Delayering
    • Main Blocks Identificatio
    • Cross-Section
  • MEMS Gyro & Accelero Dies
    • View, Dimensions & Marking
    • Bond Pad Opening & Bond Pad
    • Cap Removed & Cap Details
    • Sensing Area Details
    • Cross-Section (Sensor, Cap & Bonding)
    • Process Characteristics

Manufacturing Process Flow

  • ASIC Gyro & Accelero Front-End Process
  • MEMS Gyro & Accelero Process Flow
  • Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • Yields Hypotheses
  • ASICs Front-End Cost
  • ASICs Wafer & Die Cost
  • MEMS Gyro & Accelero Front-End Cost
  • MEMS Gyro & Accelero Front-End Cost per process steps
  • MEMS Gyro & Accelero Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test & Calibration Cost
  • SMI130 Component Cost

Estimated Price Analysis

  • Bosch Financial Ratios
  • Component Price
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