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3D-Package CoSim+

Package manufacturing cost simulation tool

Dernière mise à jour
7/07/2015
Version
3.2.1
Code produit
-
Prix
EUR 8 900
Brochure disponible Demande d'info ou démo

System Plus Consulting has developed a powerful cost simulation tool to evaluate the cost of any packaging process :

wafer-level packaging, TSV, 3D integration…

3D-Package CoSim+ is a tool designed for 3D technology

• 3D integration continues to be developed to address different 3D technology platforms with different characteristics such as package-on-package, 3D MEMS, 3D stacked memories, 3D interposers, 3D WLP of CIS…

• With manufacturing technologies in constant development with many different options, the need for cost simulation of 3D packaging is rising.

• The cost of 3D technology can be very difficult to estimate due to the wide range of technological options (TSV via-first, via-last, FOWLP, …).

3D-Package CoSim+ main features:

• Multiple process flows

• Multiple subcontracting operations

• No admin privilege is required for setup

• Results are fully open-format

• Workgroup-compliant, safely

 

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DEVICES AVAILABLE

Wafer-Level Package

  • Qualcomm WCD9335 FOWLP
  • Infineon RRN7745P/RRN7735P FOWLP
  • NXP/Freescale MR2001 FOWLP

3D TSV

  • Samsung 3D TSV Stacked DRAM
  • AMD/SK Hynix High-Bandwidth Memory (HBM)

Package-on-Package

  • Samsung Exynos 8 PoP
  • Qualcomm Snapdragon 820 PoP
  • Apple A10 PoP

Embedded Die Package

  • Texas Instruments MicroSiP
  • TDK-Epcos P8009 PMU
  • GaN Systems GS66508T Top Cooled

 

PROCESS AVAILABLE

Wafer-Level Package

  • WLCSP (FIWLP) process
  • Infineon eWLB (FOWLP) process
  • NXP/Freescale RCP (FOWLP) process

3D TSV

  • 3D TSV-middle process
  • STMicroelectronics TSV-last process
  • ams TSV-last process
  • IPDiA TSV-last process
  • Shellcase RT process
  • Shellcase MVP process

Package-on-Package

  • Through Mold Via (TMV) PoP
  • Molded Core embedded Package (MCeP) PoP
  • Integrated Fan-Out (inFO) PoP

Embedded Die Package

  • AT&S ECP process
  • TDK-Epcos SESUB process

Image Sensor Package

  • BSI process
  • Sony Stacked BSI + TSV process
  • Sony Stacked BSI Hybrid Bonding process

No video demonstration to see yet.

No files for download yet.

Do the tools include a component library?
The standard package doesn’t include a component library. But, you can add a component library with additional charges.

 

Do the tools include a process library?
The standard package doesn’t include any process library. But, you can add a process library with additional charges.

 

Since I have to detail all the process steps, do I get cost details at each step of the process?
Yes, our CoSim+ tools will provide you cost details at each step of the process.

 

How many process steps can I add to simulate my cost?
You can add unlimited process steps.

 

How can I learn to use the tools?
All tools include a helper. In CoSim+, you have a PDF file to guide you.
If needed, when you buy one of our tools, you can schedule a one-hour training session via WebEx with our engineer. You can also purchase an on-site training session if needed.

 

Which technologies can I simulate with 3D Package CoSim+?
You can simulate eWLB, RCP, TSV-Middle, TSV-Last, ECP, SESUB, MCeP, TMV, info, BSI and Hybrid Bonding with 3D Package CoSim+.

 

Which types of package can I simulate with 3D Package CoSim+?
You can simulate Wafer-Level Package, 3D TSV, Embedded Die Package, Package-on-Package and Image Sensor Package.

 

Which types of substrate can I simulate with 3D Package CoSim+?
You can simulate Silicon and Glass.

 

LICENCE / MAINTENANCE / ORDER

What is the difference between the site license and the corporate license?
The site license is for all employees in just one location. The corporate license is for all employees from the same company worldwide.

 

Once I get the license, do I need to pay something else?
The license includes maintenance for the first year. After the first year, if you wish to keep receiving our support and updates, you will need to pay the maintenance fees only. It will cost between 1,000€ and 3,500€ depending on your license type and tool.

 

Why should I pay for maintenance after the first year? Can I get maintenance for free?
Thanks to the maintenance, you get updates to the tools and database every year. Maintenance also includes support from our team.

The first year, the update is included in the license fees. You don’t have to add any other fee. However, after this first year, you will have to purchase our yearly maintenance to get our tools and database updates.

 

Can I test the tools before buying it?
System Plus Consulting doesn’t provide any trial version but you can schedule a one-hour WebEx demo with the team to get a better understanding of which tool you might need.

 

 

You still have questions, we have answered more of them, just click on the below button to consult them.
Otherwise contact us: info@systemplus.fr

You still have questions, we have answered more of them, just click on the below button to consult them.
Otherwise contact us: info@systemplus.fr

Mre FAQ 

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