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APE 2017

April 26 and 27, 2017 in Paris, France

System Plus Consulting at APE? Michel Allain, System Plus Consulting’s CEO will be present onsite,...

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Advanced Packaging & System Integration Technology Symposium

  System Plus Consulting at Advanced Packaging & System Integration Technology Symposium? Stéphane Elisabeth, Advanced...

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EEHE Conference

May 17 and 18, 2017 in Bamberg, Germany

System Plus Consulting at EEHE (Electrics / Electronics in Hybrid and Electric Vehicles and Electrical...

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Webcast: TSV technology: a key platform for heterogeneous integration

January 16, 2017 on your computer

Why attending? Is 3D TSV only a solution for high end devices? TSV could penetrate...

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APEC 2017

System Plus Consulting at APEC? Elena Barbarini, will present on « Si Vs SiC Power Modules...

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