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Rapports

Derniers rapports de Reverse Costing disponibles

  • NVIDIA Tesla P100 GPU with HBM2

    TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging

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  • Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems

    Continental consolidates its successful role in ADAS-related equipment with this cost-effective solution for emergency brake assist

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  • MEMS and Sensors for Automotive – Market and Technology Trends 2017

    How will sensor technology shape the cars of the future? We are only at the very beginning of a bright future for sensor providers – be prepared for the golden age of the automotive sensor industry

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  • InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo

    World’s first ‘7-Axis’ motion tracking device targeting drone applications

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  • EPC2045 100V GaN-on-Silicon Transistor

    Take a look at the fifth generation of EPC’s low voltage transistor

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  • IWLPC – International Wafer-Level Packaging Conference

    October 24th-25th, 2017 in San José, USA

      System Plus Consulting at IWLPC – International Wafer-Level Packaging Conference Romain Fraux, CTO at…

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  • Webcast: Fan-Out Packaging success story confirmed

    Free Webcast – October 25 at 5 PM CEST – 8 AM PDT   Fan-Out…

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Nouveaux articles

  • Innovative design and packaging are boosting the silicon 100V MOSFET industry

    Press Release by System Plus Consulting, October 2017

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  • 8GB HBM2 from Samsung becomes a standard for innovative graphic cards

    Press Release by System Plus Consulting, September 2017

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  • Thermo Fisher Scientific develops a unique solution based on Ion Torrent® technology, with a manufacturing process entirely CMOS compatible

    Press Release by Yole Group of Companies, August 2017

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