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Derniers rapports de Reverse Costing disponibles

  • TDK SESUB Bluetooth Module

    Latest release of TDK embedded die package technology

    en savoir plus
  • NanoLambda NSP32-V1 Nano Spectrometer

    First plasmonic filter sensor for consumer devices could disrupt optical applications

    en savoir plus
  • NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

    The first ultra-small multi-die low power module with boot memory and power management integrated in a package-on-package compatible device for the Internet of Things

    en savoir plus
  • MicroLED Displays

    Hype and reality: hopes for smartwatches and beyond must overcome technical and manufacturing challenges

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  • LG LA080WV3 – 8-inch Display with Touch Panel for Car Navigation

    An inside look at the reasons why LG Display is one of the top players in the automotive display market

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  • The promising future of sensors in the Internet of Things

      System Plus Consulting at The promising future of sensors in the Internet of Things…

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  • Sensor Expo & Conference

    June 27th to 29th 2017 in San José, USA

      System Plus Consulting at Sensor Expo & Conference? Romain Fraux, System Plus Consulting’s CTO will…

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Nouveaux articles

  • The audio world has stepped into another dimension

    Press Release by Yole Développement, June 2017
    (suite…)

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  • May 2017

    3D imaging & sensing technologies: an expected explosion within the consumer market segment

    Press Release by Yole Développement, May 2017
    (suite…)

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  • March 2017

    Orbotech’s SPTS Technologies accelerates industry adoption of its Mosaic™ Plasma Dicing Solution with order from JCAP

    Press Release by Orbotech’s SPTS, March 2017
    (suite…)

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