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Rapports

Derniers rapports de Reverse Costing disponibles

  • Panasonic 600V GaN HEMT PGA26E19BA

    Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure

    en savoir plus
  • Adesto CBRAM Memory

    Ultra-low power, ultra-fast memory die designed for the Internet-of-Things and wearables

    en savoir plus
  • Transphorm TPH3208PS 650V GaN HEMT

    A new 650V GaN HEMT from Transphorm with a simplified cascode structure and enhanced electrical characteristics

    en savoir plus
  • Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

    Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD

    en savoir plus
  • ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete

    In its new series of SiC MOSFETs, Rohm uses trench structures for 650V and 1200V products, while 1700V products use planar structures

    en savoir plus
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Outils

Derniers Outils de Chiffrage
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Evènements

  • Training Sessions : Integrated Circuits – MEMS – Power – Electronic Boards

    June 12th to 14th, and 21st, 2017 Nantes, France and Munich, Germany

    Next 2017 training sessions will be organised in June in France, and in Germany. We offer…

    en savoir plus
  • Webcast: RF Front End Modules for Cellphones

    Why attending? Which direction towards 4G+/5G ? The continual growth of mobile data has led…

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Nouveaux articles

  • March 2017

    Orbotech’s SPTS Technologies accelerates industry adoption of its Mosaic™ Plasma Dicing Solution with order from JCAP

    Press Release by Orbotech’s SPTS, March 2017
    (suite…)

    en savoir plus
  • February 2017

    Si, SiC und GaN im Vergleich

    Interview of Elena Barbarini by Ralf Higgelke, from DESIGN&ELEKTRONIK, February 2017
    (suite…)

    en savoir plus
  • ams, a new, strong, player in the gas sensor market

    Interview from Yole Développement

    (suite…)

    en savoir plus
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