Follow us :

fren

Power Module Packaging 2018: Material Market and Technology Trends

Report type
Manufacturer
Infineon, Intel, Mitsubishi, Semikron, STMicroelectronics
Reference
Power Module Packaging 2018
Device type
Published
26/07/2018
Product Code
YD18032
Applications
Available flyer Available sample

Automotive Power Module Packaging Comparison 2018

Report type
Reverse CostingReverse Technology
Manufacturer
Bosch, Infineon, Mitsubishi, Semikron, STMicroelectronics, Toshiba, Toyota
Reference
Automotive Power Module Packaging
Device type
Published
11/07/2018
Product Code
SP18399
Applications
Automotive
Available flyer Available sample

Power SiC 2018: Materials, Devices and Applications

Report type
Market & Technology Report
Manufacturer
Reference
Power SiC 2018
Device type
SiC
Published
06/07/2018
Product Code
YD18027
Applications
Available flyer Available sample

Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics

Report type
Reverse Costing
Manufacturer
STMicroelectronics
Reference
STMicroelectronics SiC
Device type
SiC
Published
21/06/2018
Product Code
SP18413
Applications
Automotive
Available flyer Available sample
UnitedSiC UJN1205K 1200V SiC JFET

UnitedSiC UJN1205K 1200V SiC JFET

Report type
Reverse Costing
Manufacturer
UnitedSiC
Reference
UJN1205K
Device type
SiC
Published
13/06/2018
Product Code
SP18410
Applications
Consumer Industrial
Available flyer Available sample
1 - 121234510»
© Copyright 2018 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Disclaimer l Term of use l Privacy policy l Webmaster