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Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X

Report type
Reverse Costing
Manufacturer
TSMC
Reference
Apple A11 inFO-PoP
Device type
3D Packaging,
Published
07/02/2018
Product Code
SP18373
Applications
Consumer
Available flyer Available sample
Infineon FF400R07A01E3 Double Side Cooled IGBT Module: discover Infineon‘s first double sided cooling power module for automotive - System Plus Consulting

Infineon FF400R07A01E3 Double Side Cooled IGBT Module

Report type
Reverse Costing
Manufacturer
Infineon
Reference
Infineon FF400R07A01E3
Device type
IGBT,
Published
23/01/2018
Product Code
SP18375
Applications
Automotive
Available flyer Available sample
SP18374 - Qualcomm QCA9500 60 GHz Chipset - System Plus Consulting

Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QCA9500 WiGig Chipset
Device type
3D Packaging, Embedded, RF IC, SIP
Published
17/01/2018
Product Code
SP18374
Applications
Automotive Consumer Industrial
Available flyer Available sample
Thermal management solution, comparative technology analysis : 10 flagship smartphones from Apple, Samsung, Huawei, LG and Xiaomi - System Plus Consulting

Thermal Management in Smartphones: Technology Comparison 2017

Report type
Reverse Technology
Manufacturer
Apple, Huawei, LG, Samsung, Xiaomi
Reference
Thermal Management
Device type
Published
29/11/2017
Product Code
SP17369
Applications
Consumer
Available flyer Available sample
AMD Radeon Vega Frontier New GPU with Samsung 8-Hi second generation high bandwidth memory and 2.5D chip-on-wafer packaging from SPIL

AMD Radeon Vega Frontier Edition

Report type
Reverse Costing
Manufacturer
AMD
Reference
AMD Readon
Device type
3D Packaging,
Published
22/11/2017
Product Code
SP17360
Applications
Consumer
Available flyer Available sample
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