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TDK SESUB Bluetooth Module

Report type
Reverse Costing
Manufacturer
TDK
Reference
TDK SESUB
Device type
Embedded,
Published
21/06/2017
Product Code
SP17306
Applications
Consumer
Available flyer Available sample
NanoLambda NSP32-V1 Nano Spectrometer: First plasmonic filter sensor for consumer devices could disrupt optical applications - System Plus Consulting

NanoLambda NSP32-V1 Nano Spectrometer

Report type
Reverse Costing
Manufacturer
TDK
Reference
NanoLambda NSP32-V1
Device type
3D Packaging, Light, Visible
Published
15/06/2017
Product Code
SP17334
Applications
Consumer Industrial Medical
Available flyer Available sample
NXP SCM-i.MX6 first ultra-small multi-die low power module, Quad High Density Fan-Out Wafer-Level System-in-Package for the IoT - System Plus Consulting

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

Report type
Reverse Costing
Manufacturer
NXP
Reference
NXP SCM-i.MX6
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/06/2017
Product Code
SP17339
Applications
Consumer Industrial
Available flyer Available sample

Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Report type
Reverse Costing
Manufacturer
Taiyo Yuden
Reference
Taiyo Yuden SAW and BAW Band 7 Duplexer
Device type
3D Packaging, RF IC
Published
03/05/2017
Product Code
SP17327
Applications
Consumer
Available flyer Available sample

FPC’s FPC1268 in the Huawei Mate 9 Pro and Huawei P10 series

Report type
Reverse Costing
Manufacturer
Fingerprint Cards
Reference
FPC1268
Device type
FingerPrint,
Published
05/04/2017
Product Code
SP17318
Applications
Consumer
Available flyer Available sample
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