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Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Report type
Reverse Costing
Manufacturer
Taiyo Yuden
Reference
Taiyo Yuden SAW and BAW Band 7 Duplexer
Device type
3D Packaging, RF IC
Published
03/05/2017
Product Code
SP17327
Applications
Consumer
Available flyer Available sample

FPC’s FPC1268 in the Huawei Mate 9 Pro and Huawei P10 series

Report type
Reverse Costing
Manufacturer
Fingerprint Cards
Reference
FPC1268
Device type
FingerPrint,
Published
05/04/2017
Product Code
SP17318
Applications
Consumer
Available flyer Available sample

mCube MC3672: The smallest WLCSP MEMS Accelerometer for Wearables

Report type
Reverse Costing
Manufacturer
mCube
Reference
mCube MC3672
Device type
3D Packaging, Accelerometer,
Published
08/03/2017
Product Code
SP17315
Applications
Consumer
Available flyer Available sample
2016 Comparison of Application Processor (AP) Packaging: TSMC’s inFO vs. Amkor’s PoP vs. Samsung’s PoP vs. Shinko’s MCeP - System Plus Consulting

2016 Comparison of Application Processor Packaging

Report type
Reverse Costing
Manufacturer
TSMC
Reference
AP Packaging Comparison
Device type
3D Packaging,
Published
20/12/2016
Product Code
SP16303
Applications
Consumer
Available flyer Available sample
Deep Trench Capcitors as land-side decoupling capacitors and IPD technology from TSMC used for Apple’s A10 application processor - System Plus Consulting

TSMC Deep Trench Capacitor

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC DTC
Device type
3D Packaging,
Published
18/10/2016
Product Code
SP16300
Applications
Consumer
Available flyer Available sample
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