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New inFO packaging technology from TSMC used for Apple’s A10 application processor, found in the iPhone 7 and 7 Plus - System Plus Consulting

TSMC Integrated Fan-Out Package

Report type
Reverse Costing
Manufacturer
TSMC
Reference
TSMC inFO Package
Device type
3D Packaging, WLP
Published
18/10/2016
Product Code
SP16290
Applications
Consumer
Available flyer Available sample
Fan-Out activity revenues forecast (M$) - Breakdown by Fan-Out market type

Fan-Out: Technologies & Market Trends 2016

Report type
Market & Technology Report
Manufacturer
Reference
Fan-Out 2016
Device type
Market report, WLP
Published
26/08/2016
Product Code
Yole Développement report
Applications
Available flyer Available sample
Package Cross-Section Qualcomm Fan-Out WCD9335 - System Plus Consulting

Qualcomm WCD9335

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
WCD9335
Device type
Integrated Circuit, WLP
Published
27/04/2016
Product Code
SP16267
Applications
Consumer
Available flyer Available sample

NXP MR2001

Report type
Reverse Costing
Manufacturer
NXP
Reference
MR2001
Device type
RF IC, WLP
Published
31/03/2016
Product Code
SP16263
Applications
Automotive
Available flyer Available sample

Infineon RRN7745P & RTN7735P eWLB Fan-Out Package – 77GHz Radar Dies

Report type
Reverse Costing
Manufacturer
Infineon
Reference
Infineon RRN7745P & RTN7735P 77GHz Radar
Device type
RF IC, WLP
Published
22/10/2015
Product Code
SP15235
Applications
Automotive
Available flyer Available sample
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