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SP18374 - Qualcomm QCA9500 60 GHz Chipset - System Plus Consulting

Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QCA9500 WiGig Chipset
Device type
3D Packaging, RF IC, SIP
Published
17/01/2018
Product Code
SP18374
Applications
Automotive Consumer Industrial
Available flyer Available sample
Advanced RF SiPs for Cellphones: Reverse Costing Overview from Skyworks, Murata, TDK-Epcos, Qorvo & Broadcom/Avago - System Pus Consulting

Advanced RF SiPs for Cell Phones: Reverse Costing Overview

Report type
Reverse Costing
Manufacturer
Avago, Broadcom, Murata, Qorvo, Skyworks, TDK
Reference
RF SiP
Device type
RF IC, SIP
Published
15/11/2017
Product Code
SP17364
Applications
Consumer
Available flyer Available sample
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample
Advanced RF System-in-Package for Cell Phones 2017: 5G mmWave, 5G sub 6 GHz - which packaging architectures can rise to the occasion? - Yole Développement

Advanced RF System-in-Package for Cell Phones Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
RF SiP
Device type
Market report, RF IC, SIP
Published
15/11/2017
Product Code
YDAP17041
Applications
Consumer
Available flyer Available sample
NXP SCM-i.MX6 first ultra-small multi-die low power module, Quad High Density Fan-Out Wafer-Level System-in-Package for the IoT - System Plus Consulting

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-Package

Report type
Reverse Costing
Manufacturer
NXP
Reference
NXP SCM-i.MX6
Device type
3D Packaging, Embedded, SIP, WLP
Published
14/06/2017
Product Code
SP17339
Applications
Consumer Industrial
Available flyer Available sample
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