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Samsung Galaxy S9+ Teardown and Identification of key devices, advanced packaging technical choices and main suppliers - System Plus Consulting

Samsung Galaxy S9+ Teardown and Identification of Key Components

Report type
Reverse TechnologySystem
Manufacturer
Samsung
Reference
Samsung S9+
Device type
3D Packaging, Embedded, SIP, Telecom, WLP
Published
28/03/2018
Product Code
SP18402
Applications
Consumer
Available flyer Available sample
SP18374 - Qualcomm QCA9500 60 GHz Chipset - System Plus Consulting

Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QCA9500 WiGig Chipset
Device type
3D Packaging, Embedded, RF IC, SIP
Published
17/01/2018
Product Code
SP18374
Applications
Automotive Consumer Industrial
Available flyer Available sample
Advanced RF SiPs for Cellphones: Reverse Costing Overview from Skyworks, Murata, TDK-Epcos, Qorvo & Broadcom/Avago - System Pus Consulting

Advanced RF SiPs for Cell Phones: Reverse Costing Overview

Report type
Reverse Costing
Manufacturer
Avago, Broadcom, Murata, Qorvo, Skyworks, TDK
Reference
RF SiP
Device type
RF IC, SIP
Published
15/11/2017
Product Code
SP17364
Applications
Consumer
Available flyer Available sample
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Compass, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample
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