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GaN Systems GaNpx Top Cooled – AT&S ECP® Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S, GaN Systems
Reference
GS66508T
Device type
Embedded, GaN,
Published
08/10/2015
Product Code
SP15233
Applications
Industrial
Available flyer Available sample

GaN Systems GS66508P 650V HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GS66508P
Device type
Embedded, GaN,
Published
08/01/2015
Product Code
SP15202
Applications
Available flyer Available sample

GaN Systems HEMT Embedded Power Die Package

Report type
Reverse Costing
Manufacturer
AT&S
Reference
GS66508P
Device type
Embedded, GaN,
Published
15/01/2015
Product Code
RS202
Applications
Industrial
Available flyer Available sample

TDK-EPC P8009 Module with Maxim Embedded Dies

Report type
Reverse Costing
Manufacturer
TDK
Reference
P8009
Device type
Embedded,
Published
05/06/2013
Product Code
SP13133
Applications
Available flyer Available sample

Rohm – DC/DC Micro Converter TDK-EPC Embedded Die Process

Report type
Reverse Costing
Manufacturer
Rohm
Reference
DC/DC Micro Converter
Device type
Embedded,
Published
22/01/2013
Product Code
SP13113
Applications
Industrial
Available flyer Available sample
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