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Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm WiGig Chipset Smartphone Edition
Device type
3D Packaging, RF IC
Published
03/07/2018
Product Code
SP18393
Applications
Consumer
Available flyer Available sample
Processor Package

Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP

Report type
Reverse Costing
Manufacturer
Qualcomm, Samsung
Reference
Processor Packages
Device type
3D Packaging, Embedded,
Published
06/06/2018
Product Code
SP18406
Applications
Consumer
Available flyer Available sample

GaN Systems GS61004B GaN HEMT

Report type
Reverse Costing
Manufacturer
GaN Systems
Reference
GaN Systems GS61004B GaN HEMT
Device type
3D Packaging, GaN,
Published
06/06/2018
Product Code
SP18391
Applications
Automotive Consumer Industrial
Available flyer Available sample

Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X

Report type
Reverse Costing
Manufacturer
TSMC
Reference
Apple A11 inFO-PoP
Device type
3D Packaging,
Published
07/02/2018
Product Code
SP18373
Applications
Consumer
Available flyer Available sample
SP18374 - Qualcomm QCA9500 60 GHz Chipset - System Plus Consulting

Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Qualcomm QCA9500 WiGig Chipset
Device type
3D Packaging, RF IC, SIP
Published
17/01/2018
Product Code
SP18374
Applications
Automotive Consumer Industrial
Available flyer Available sample
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