Follow us :

fren
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Compass, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample

SiTime SiT1552 – MEMS Oscillator

Report type
Reverse Costing
Manufacturer
SiTime
Reference
SiT1552
Device type
Oscillator, WLP
Published
02/07/2015
Product Code
SP15214
Applications
Consumer
Available flyer Available sample

Silicon Labs Si504 MEMS Oscillator

Report type
Reverse Costing
Manufacturer
Silicon Labs
Reference
Si504
Device type
Oscillator
Published
08/01/2014
Product Code
SP14147
Applications
Available flyer Available sample

Discera DSC8002 MEMS Oscillator

Report type
Reverse Costing
Manufacturer
Discera
Reference
DSC8002
Device type
Oscillator
Published
15/12/2010
Product Code
SP10050
Applications
Available flyer Available sample
1 - 212
© Copyright 2017 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Disclaimer l Term of use l Privacy policy l Webmaster