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MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Compass, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample
Vesper VM1000, first piezoelectric MEMS microphone could disrupt consumer applications

Vesper VM1000 Piezoelectric Microphone

Report type
Reverse Costing
Manufacturer
Vesper
Reference
Vesper VM1000
Device type
Microphone
Published
14/02/2017
Product Code
SP17314
Applications
Consumer Industrial
Available flyer Available sample
Apple MEMS Microphones _ MEMS die_ System Plus Consulting

Apple iPhone 7 Plus: MEMS Microphones

Report type
Reverse Costing
Manufacturer
Apple, Infineon, Knowles, STMicroelectronics
Reference
iPhone 7 - MEMS Microphones
Device type
Microphone
Published
26/10/2016
Product Code
SP16292-SP16294-SP16296
Applications
Consumer
Available flyer Available sample

InvenSense ICS43432 Microphone

Report type
Reverse Costing
Manufacturer
Invensense
Reference
ICS43432
Device type
Microphone
Published
17/10/2014
Product Code
SP14189
Applications
Consumer
Available flyer Available sample
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