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MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Compass, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample
InvenSense ICM20789: High Performance 6-Axis Motion Sensor & Pressure Sensor Combo first ‘7-Axis’ motion tracking device targeting drone applications

InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor Combo

Report type
Reverse Costing
Manufacturer
Invensense
Reference
InvenSense ICM-20789
Device type
IMU/Combo,
Published
04/10/2017
Product Code
SP17361
Applications
Consumer
Available flyer Available sample

6-Axis OIS IMUs

Report type
Reverse Costing
Manufacturer
Invensense, STMicroelectronics
Reference
InvenSense IMU and STMicroelectronics LSM6DSM
Device type
IMU/Combo,
Published
06/12/2016
Product Code
SP16291 - SP16297
Applications
Consumer
Available flyer Available sample
ICM30630 InvenSense Package opening Gyro Acc 6-axis System Plus Consulting

InvenSense ICM-30630

Report type
Reverse Costing
Manufacturer
Invensense
Reference
ICM-30630
Device type
IMU/Combo,
Published
20/04/2016
Product Code
SP16260
Applications
Consumer
Available flyer Available sample
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