Follow us :

fren
MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Compass, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample

2-Axis Gyroscopes for Optical Image Stabilization

Report type
Reverse Costing
Manufacturer
Invensense, STMicroelectronics
Reference
2-Axis Gyroscopes for OIS
Device type
Gyroscope,
Published
09/11/2016
Product Code
SP16298-SP16299
Applications
Consumer
Available flyer Available sample

STMicroelectronics A3G4250D Automotive MEMS Gyroscope

Report type
Reverse Costing
Manufacturer
STMicroelectronics
Reference
A3G4250D
Device type
Gyroscope,
Published
29/10/2014
Product Code
SP14187
Applications
Automotive
Available flyer Available sample

Analog Devices ADIS16136 Precision Angular Rate Sensor

Report type
Reverse Costing
Manufacturer
Analog Devices
Reference
ADIS16136
Device type
Gyroscope,
Published
24/09/2014
Product Code
SP14176
Applications
Industrial
Available flyer Available sample
1 - 41234
© Copyright 2017 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Disclaimer l Term of use l Privacy policy l Webmaster