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MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

FPC’s FPC1268 in the Huawei Mate 9 Pro and Huawei P10 series

Report type
Reverse Costing
Manufacturer
Fingerprint Cards
Reference
FPC1268
Device type
FingerPrint,
Published
05/04/2017
Product Code
SP17318
Applications
Consumer
Available flyer Available sample
Qualcomm Ultrasonic Fingerprint Sensor Cells

Qualcomm® Snapdragon Sense™ ID 3D Fingerprint

Report type
Reverse Costing
Manufacturer
Qualcomm
Reference
Snapdragon Sense™ ID 3D
Device type
FingerPrint,
Published
17/08/2016
Product Code
SP16282
Applications
Consumer
Available flyer Available sample
Sensor Die NEXTBiometrics fingerprint System Plus Consulting

NEXT Biometrics NB-1010-U/NB-2020-U

Report type
Reverse Costing
Manufacturer
NEXT Biometrics
Reference
NB-1010-U/NB-2020-U
Device type
FingerPrint,
Published
17/05/2016
Product Code
SP16271
Applications
Consumer
Available flyer Available sample

EgisTec ET300 Fingerprint Sensor

Report type
Reverse Costing
Manufacturer
EgisTec
Reference
EgisTec ET300
Device type
FingerPrint,
Published
18/02/2016
Product Code
SP16248
Applications
Consumer
Available flyer Available sample
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