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MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Compass, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample
Bosch BME680 world's first environmental sensor combining gas, pressure, humidity and temperature in a 3mm x 3mm footprint package - System Plus Consulting

Bosch BME680 Environmental Sensor with Integrated Gas Sensor

Report type
Reverse Costing
Manufacturer
Bosch
Reference
Bosch BME680
Device type
Environment, Pressure sensor
Published
19/07/2017
Product Code
SP17342
Applications
Consumer
Available flyer Available sample

Relative Humidity Sensors Technology and Cost Review

Report type
Reverse Costing
Manufacturer
Alps, Bosch, Measurement, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument
Reference
Humidity Sensors
Device type
Environment,
Published
04/02/2016
Product Code
SP16223
Applications
Available flyer Available sample

Cambridge CMOS Sensor CCS801

Report type
Reverse Costing
Manufacturer
Cambridge CMOS Sensors
Reference
CCS801
Device type
Environment,
Published
28/10/2015
Product Code
SP15236
Applications
Consumer
Available flyer Available sample
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