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MEMS Packaging

MEMS Packaging: Reverse Technology Review

Report type
Reverse Technology
Manufacturer
Alps, AMS, Analog Devices, Bosch, Flir, Infineon, Invensense, Maxim Integrated, mCube, Measurement, Murata, NXP, Sensirion, Silicon Labs, STMicroelectronics, Texas Instrument, Yamaha
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
SP17352
Applications
Automotive Consumer
Available flyer Available sample

MEMS Packaging – Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
MEMS Packaging
Device type
3D Packaging, Accelerometer, Compass, Embedded, Environment, FingerPrint, Gyroscope, IMU/Combo, Microphone, Oscillator, Pressure sensor, SIP, WLP
Published
25/10/2017
Product Code
YDAP17045
Applications
Available flyer Available sample

mCube MC3672: The smallest WLCSP MEMS Accelerometer for Wearables

Report type
Reverse Costing
Manufacturer
mCube
Reference
mCube MC3672
Device type
3D Packaging, Accelerometer,
Published
08/03/2017
Product Code
SP17315
Applications
Consumer
Available flyer Available sample
Colibrys VS1000 Accelerometer

Safran Colibrys VS1000 Series

Report type
Reverse Costing
Manufacturer
Safran Colibrys
Reference
Colibrys VS1000
Device type
Accelerometer,
Published
11/01/2017
Product Code
SP17269
Applications
Industrial
Available flyer Available sample
mCube MC3635 - System Plus Consulting

mCube MC3635

Report type
Reverse Costing
Manufacturer
mCube
Reference
MC3635
Device type
Accelerometer,
Published
05/04/2016
Product Code
SP16256
Applications
Consumer
Available flyer Available sample
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