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Adesto CBRAM Memory: Ultra-low power, ultra-fast memory die designed for the Internet-of-Things and wearables - System Plus Consulting

Adesto CBRAM Memory

Report type
Reverse Costing
Manufacturer
Adesto
Reference
Adesto CBRAM
Device type
Integrated Circuit
Published
17/05/2017
Product Code
SP17341
Applications
Consumer Medical
Available flyer Available sample

Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Report type
Reverse Costing
Manufacturer
Taiyo Yuden
Reference
Taiyo Yuden SAW and BAW Band 7 Duplexer
Device type
3D Packaging, RF IC
Published
03/05/2017
Product Code
SP17327
Applications
Consumer
Available flyer Available sample
Review of RF front-end modules and components found in five flagship smartphones: Apple iPhone 7 Plus, Samsung Galaxy S7, Huawei P9, LG G5, and Xiaomi Mi5.

Smartphone RF Front-End Module Review

Report type
Reverse Costing
Manufacturer
Avago, Multiple, Murata, Qorvo, Qualcomm
Reference
RF Module
Device type
RF IC
Published
07/03/2017
Product Code
SP17316
Applications
Consumer
Available flyer Available sample
Texas Instruments DRA726 Jacinto 6 Eco SoC Processor, Cost-optimized in-vehicle infotainment for entry- to mid-level automobile - System Plus Consulting

Texas Instruments DRA726

Report type
Reverse Costing
Manufacturer
Texas Instrument
Reference
Texas Instruments DRA726
Device type
Integrated Circuit
Published
05/10/2016
Product Code
SP16285
Applications
Automotive
Available flyer Available sample

Murata FAJ15 – SAW Thermo-Compensated Filter

Report type
Reverse Costing
Manufacturer
Murata
Reference
Murata FAJ15
Device type
RF IC
Published
30/08/2016
Product Code
SP16283
Applications
Consumer
Available flyer Available sample
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