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BCD (Bipolar-CMOS-DMOS) integrated circuit (IC): comparative study on technologies from Infineon, NXP, and more manufacturers - System Plus Consulting

BCD Technology and Cost Review

Report type
Reverse CostingReverse Technology
Manufacturer
Analog Devices, Bosch, Denso, Elmos, Freescale, Infineon, Linear Technology, NXP, Renesas, STMicroelectronics, Texas Instrument, Toyota
Reference
BCD
Device type
Integrated Circuit
Published
30/08/2017
Product Code
SP17335
Applications
Automotive Consumer Industrial
Available flyer Available sample
Adesto CBRAM Memory: Ultra-low power, ultra-fast memory die designed for the Internet-of-Things and wearables - System Plus Consulting

Adesto CBRAM Memory

Report type
Reverse Costing
Manufacturer
Adesto
Reference
Adesto CBRAM
Device type
Integrated Circuit
Published
17/05/2017
Product Code
SP17341
Applications
Consumer Medical
Available flyer Available sample

Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Report type
Reverse Costing
Manufacturer
Taiyo Yuden
Reference
Taiyo Yuden SAW and BAW Band 7 Duplexer
Device type
3D Packaging, RF IC
Published
03/05/2017
Product Code
SP17327
Applications
Consumer
Available flyer Available sample
Review of RF front-end modules and components found in five flagship smartphones: Apple iPhone 7 Plus, Samsung Galaxy S7, Huawei P9, LG G5, and Xiaomi Mi5.

Smartphone RF Front-End Module Review

Report type
Reverse Costing
Manufacturer
Avago, Multiple, Murata, Qorvo, Qualcomm
Reference
RF Module
Device type
RF IC
Published
07/03/2017
Product Code
SP17316
Applications
Consumer
Available flyer Available sample
Texas Instruments DRA726 Jacinto 6 Eco SoC Processor, Cost-optimized in-vehicle infotainment for entry- to mid-level automobile - System Plus Consulting

Texas Instruments DRA726

Report type
Reverse Costing
Manufacturer
Texas Instrument
Reference
Texas Instruments DRA726
Device type
Integrated Circuit
Published
05/10/2016
Product Code
SP16285
Applications
Automotive
Available flyer Available sample
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