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Advanced RF SiPs for Cellphones: Reverse Costing Overview from Skyworks, Murata, TDK-Epcos, Qorvo & Broadcom/Avago - System Pus Consulting

Advanced RF SiPs for Cell Phones: Reverse Costing Overview

Report type
Reverse Costing
Manufacturer
Avago, Broadcom, Murata, Qorvo, Skyworks, TDK
Reference
RF SiP
Device type
RF IC, SIP
Published
15/11/2017
Product Code
SP17364
Applications
Consumer
Available flyer Available sample
Advanced RF System-in-Package for Cell Phones 2017: 5G mmWave, 5G sub 6 GHz - which packaging architectures can rise to the occasion? - Yole Développement

Advanced RF System-in-Package for Cell Phones Market and Technology Trends 2017

Report type
Market & Technology Report
Manufacturer
Reference
RF SiP
Device type
Market report, RF IC, SIP,
Published
15/11/2017
Product Code
YDAP17041
Applications
Consumer
Available flyer Available sample

Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

Report type
Reverse Costing
Manufacturer
Taiyo Yuden
Reference
Taiyo Yuden SAW and BAW Band 7 Duplexer
Device type
3D Packaging, RF IC
Published
03/05/2017
Product Code
SP17327
Applications
Consumer
Available flyer Available sample
Review of RF front-end modules and components found in five flagship smartphones: Apple iPhone 7 Plus, Samsung Galaxy S7, Huawei P9, LG G5, and Xiaomi Mi5.

Smartphone RF Front-End Module Review

Report type
Reverse Costing
Manufacturer
Avago, Multiple, Murata, Qorvo, Qualcomm
Reference
RF Module
Device type
RF IC
Published
07/03/2017
Product Code
SP17316
Applications
Consumer
Available flyer Available sample

Murata FAJ15 – SAW Thermo-Compensated Filter

Report type
Reverse Costing
Manufacturer
Murata
Reference
Murata FAJ15
Device type
RF IC
Published
30/08/2016
Product Code
SP16283
Applications
Consumer
Available flyer Available sample
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