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Reports

Most recent Reverse
Costing reports

  • Rohm SiC MOSFET Gen3 Trench Design Family

    Trench technology in Rohm 650V and 1200V SiC MOSFETs.

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  • STMicroelectronics ToF Proximity Sensor & Flood Illuminator in the Apple iPhone X – Patent-to-Product Mapping

    What are the main patented features of this Apple iPhone X proximity sensor and flood illuminator?

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  • 5G’s Impact on RF Front-End Module and Connectivity for Cell Phones 2018

    How is 5G enabling new business opportunities despite flat mobile growth?

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  • Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison

    ALS and proximity sensor comparison for the latest three smartphone generations: Galaxy S7, S8 and S9 and iPhone 7, 8 and X.

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  • Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution

    SiGe based millimeter-wave chipset commercially available for backhaul applications with beamforming capability.

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Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools

Events

  • CIOE Executive Forums 2018

    September 6-7, 2018 Shenzhen, China

         System Plus Consulting at CIOE Executive Forums 2018? Romain Fraux, Chief Executive Officer (CEO)…

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  • European Microwave Week 2018

    System Plus Consulting at European Microwave Week 2018? Dr. Stéphane Elisabeth, Project Manager at System…

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New articles

  • 2018, a new year for RF FE module market

    Press Release by System Plus Consulting, Knowmade & Yole Développement, July 2018

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  • Automotive is driving SiC adoption

    Press Release by System Plus Consulting & Yole Développement, July 2018

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  • MEMS pressure sensor technologies : multiple ways to success

    Press Release by System Plus Consulting & Yole Développement, June 2018

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