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Reports

Most recent Reverse
Costing reports

  • TRW S-Cam 3 – Forward Automotive Camera for Advanced Driver Assistance Systems

    Third and latest version of TRW’s best-selling S-Cam series forward camera

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  • Continental MFC430TA – Forward Automotive Camera for Advanced Driver Assistance Systems

    Continental attempts to penetrate the forward camera market with a distinctive architecture and cost effective solution

    Read more
  • Bosch MPC2 – Forward Automotive Camera for Advanced Driver Assistance Systems

    Bosch confirms its will to catch up on the forward camera market with a second issue of their multipurpose camera

    Read more
  • ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete

    In its new series of SiC MOSFETs, Rohm uses trench structures for 650V and 1200V products, while 1700V products use planar structures

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  • LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module from LeddarTech

    LeddarTech’s new LiDAR has no moving parts, giving it the smallest form factor while integrating the latest innovations in LiDAR technology

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Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools

Events

  • Training Sessions : Integrated Circuits – MEMS – Power – Electronic Boards

    June 12th to 14th, and 21st, 2017 Nantes, France and Munich, Germany

    Next 2017 training sessions will be organised in June in France, and in Germany. We offer…

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  • Advanced Packaging & System Integration Technology Symposium

    April 20 and 21, 2017 in Wuxi, China

      System Plus Consulting at Advanced Packaging & System Integration Technology Symposium? Stéphane Elisabeth, Advanced…

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New articles

  • March 2017

    Orbotech’s SPTS Technologies accelerates industry adoption of its Mosaic™ Plasma Dicing Solution with order from JCAP

    Press Release by Orbotech’s SPTS, March 2017
    (more…)

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  • February 2017

    Si, SiC und GaN im Vergleich

    Interview of Elena Barbarini by Ralf Higgelke, from DESIGN&ELEKTRONIK, February 2017
    (more…)

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  • March 2017

    4G and 5G are changing the RF front-end industry landscape: what are the next steps?

    Press Release by Yole Développement, March 2017
    (more…)

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