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Reports

Most recent Reverse
Costing reports

  • Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM and DSP

    A closer look at the impressive, industry-first, tri-layer stacked CIS

    Read more
  • Bosch BME680 Environmental Sensor with Integrated Gas Sensor

    The world's first environmental sensor combining gas, pressure, humidity and temperature sensing functions in a 3mm x 3mm footprint package

    Read more
  • Texas Instruments LMG3410 600V GaN FET Power Stage

    The first high-voltage driver-integrated solution, from Texas Instruments

    Read more
  • Texas Instruments’ Time of Flight Image Sensor for Industrial Applications

    A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications

    Read more
  • Melexis Time of Flight Imager for Automotive Applications

    A cutting-edge ToF imager technology from Sony/Softkinetic, adapted by Melexis for automotive in-cabin applications

    Read more
See all reports

Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

    Read more
  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

    Read more
  • MEMS Price+

    Costing tool for MEMS

    Read more
  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

    Read more
  • Power Price+

    Costing tool for active power components & modules

    Read more
See all costing tools

Events

  • IWLPC – International Wafer-Level Packaging Conference

    October 24th to 26th, 2017 in San José, USA

      System Plus Consulting at IWLPC – International Wafer-Level Packaging Conference? Romain Fraux, CTO at…

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  • SEMI European MEMS & Sensors / Imaging & Sensors Summit

    September 20th to 22nd, 2017 in Grenoble, France

      System Plus Consulting at European MEMS & Sensors / Imaging & Sensors Summit? Romain…

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New articles

  • NXP and Nepes are creating value with their first FO PoP SiP for IoT

    Press Release by Yole Développement, July 2017
    (more…)

    Read more
  • The audio world has stepped into another dimension

    Press Release by Yole Développement, June 2017
    (more…)

    Read more
  • 3D imaging & sensing technologies: an expected explosion within the consumer market segment

    Press Release by Yole Développement, May 2017
    (more…)

    Read more
See all news
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