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Reports

Most recent Reverse
Costing reports

  • Silicon Capacitor Technology and Cost Review

    Discover the differences between silicon capacitor technologies from TSMC, Skyworks, Murata/IPDiA and Vishay and their related costs

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  • FLIR Boson – a small, innovative, low power, smart thermal camera core

    An infrared camera with a powerful vision processor in a small package, using a new 12µm microbolometer

    Read more
  • BCD Technology and Cost Review

    In-depth comparative study on 23 Bipolar-CMOS-DMOS integrated circuit technologies from Infineon, STMicroelectronics, Freescale/NXP, Renesas and eight other manufacturers

    Read more
  • Bosch Mobility Ultrasonic Sensor

    An ultrasonic sensor in a compact housing, with 20-450cm detection range

    Read more
  • Industrial 100V MOSFET Technology and Cost Review

    The MOSFET universe is wide and varied: discover all the different technologies used in industrial 100V MOSFETs and their related costs.

    Read more
See all reports

Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

    Read more
  • Power Price+

    Costing tool for active power components & modules

    Read more
See all costing tools

Events

  • Training Sessions : Integrated Circuits – MEMS – Power

    November 7th, 8th and 9th, 2017 London, UK

    Next 2017 training sessions will be organised in November in London, UK. We offer three different…

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  • SEMI European MEMS & Sensors / Imaging & Sensors Summit

    September 20th to 22nd, 2017 in Grenoble, France

      System Plus Consulting at European MEMS & Sensors / Imaging & Sensors Summit? Romain…

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New articles

  • 8GB HBM2 from Samsung becomes a standard for innovative graphic cards

    Press Release by System Plus Consulting, September 2017

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  • Thermo Fisher Scientific develops a unique solution based on Ion Torrent® technology, with a manufacturing process entirely CMOS compatible

    Press Release by Yole Group of Companies, August 2017

    Read more
  • NXP and Nepes are creating value with their first FO PoP SiP for IoT

    Press Release by Yole Développement, July 2017

    Read more
See all news
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