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Reports

Most recent Reverse
Costing reports

  • Samsung Galaxy S6 Fingerprint Sensor

    Second generation Samsung Galaxy fingerprint sensor: same capacitive technology but totally different design

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  • Transphorm TPH3002PS

    High voltage GaN HEMT developed for the high frequency operation in a low-inductance source terminal TO220 package

    Read more
  • mCube MC3413

    The First Monolithic 3D MEMS Single-Chip Accelerometer in 1mm²

    Read more
  • STMicroelectronics HTS221

    High performances humidity sensor based on STMicroelectronics capacitive digital sensor in a tiny compact package

    Read more
  • Mobileye EyeQ3®

    3rd Generation Mobileye Processor For Vision Based Driver Assistance Systems

    Read more
See all reports

Tools

Most recent Costing
Tools

  • MEMS Price+

    Costing tool for MEMS

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  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

    Read more
  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

    Read more
  • Power Price+

    Costing tool for active power components & modules

    Read more
See all costing tools

Events

  • Webcast : Cost Estimation of MEMS is easier with MEMS Price+

    June 4, 2015
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  • Next IC Training Session in San Jose on June 9th, 2015

    TRAINING IC_CA_Page_1

      System Plus Consulting offers a training session on Cost Methods of ICs, designed to…

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New articles

  • Newsletter #4

    Newsletter of February 2015 by System Plus Consulting

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  • i-Micronews December 2014

    Article “FLIR ONE: the first consumer thermal imager with a microbolometer” by System Plus Consulting.

    Read more
  • MEMS’Trends #15

    Article “Adding value to MEMS with bigger die” by System Plus Consulting.

    Read more
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