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Reports

Most recent Reverse
Costing reports

  • Panasonic 600V GaN HEMT PGA26E19BA

    Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure

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  • Adesto CBRAM Memory

    Ultra-low power, ultra-fast memory die designed for the Internet-of-Things and wearables

    Read more
  • Transphorm TPH3208PS 650V GaN HEMT

    A new 650V GaN HEMT from Transphorm with a simplified cascode structure and enhanced electrical characteristics

    Read more
  • Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in Package

    Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD

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  • TRW S-Cam 3 – Forward Automotive Camera for Advanced Driver Assistance Systems

    Third and latest version of TRW’s best-selling S-Cam series forward camera

    Read more
See all reports

Tools

Most recent Costing
Tools

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

    Read more
See all costing tools

Events

  • Training Sessions : Integrated Circuits – MEMS – Power – Electronic Boards

    June 12th to 14th, and 21st, 2017 Nantes, France and Munich, Germany

    Next 2017 training sessions will be organised in June in France, and in Germany. We offer…

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  • Webcast: RF Front End Modules for Cellphones

    June 14th, 2017 on your computer

    Why attending? Which direction towards 4G+/5G ? The continual growth of mobile data has led…

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New articles

  • March 2017

    Orbotech’s SPTS Technologies accelerates industry adoption of its Mosaic™ Plasma Dicing Solution with order from JCAP

    Press Release by Orbotech’s SPTS, March 2017
    (more…)

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  • February 2017

    Si, SiC und GaN im Vergleich

    Interview of Elena Barbarini by Ralf Higgelke, from DESIGN&ELEKTRONIK, February 2017
    (more…)

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  • March 2017

    4G and 5G are changing the RF front-end industry landscape: what are the next steps?

    Press Release by Yole Développement, March 2017
    (more…)

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See all news
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