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Most recent Reverse
Costing reports

  • ams’ Spectral Sensor Portfolio: the AS726X Series

    Apple iPhone X capacities, with a standard offer from ams

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  • Power Discrete Packaging Comparison 2018

    A cost-oriented overview of evolutionary trends in power discrete packages, from mW to kW

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  • Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens

    A small, easy to use, low-power, cheap non-contact temperature measurement for varying applications.

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  • RF Front-End Module Comparison 2018

    Extensive overview of 40 RF Front-End modules and components found in 10 flagship products, including the Apple Watch Series 3, iPhone 8 and X, Samsung Galaxy S8, Huawei P10, Asus Zenfone 4 Pro, Sony XZs and Xiaomi Mi6.

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  • Littelfuse Silicon Carbide MOSFET LSIC1MO120E0080: 1200V 25A 80mOhms

    Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.

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Most recent Costing

  • IC Price+

    Costing tool for integrated circuits

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  • MEMS CoSim+

    MEMS manufacturing cost simulation tool

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  • MEMS Price+

    Costing tool for MEMS

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  • Power CoSim+

    Semiconductors manufacturing cost simulation tool

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  • Power Price+

    Costing tool for active power components & modules

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See all costing tools


  • Costing Methods Training Sessions : Integrated Circuits – MEMS – Power – Electronics Boards

    Next 2018 training sessions will be organised in April in Paris, France, in June in Munich,…

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  • Sensors Expo & Conference 2018

    June 26th to 28th, 2018 San José, USA

      System Plus Consulting at Sensors Expo & Conference? Romain Fraux, CTO at System Plus…

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New articles

  • Power electronics for EV/HEV: who will take benefit of the explosion industry? China, Europe…

    Press Release by System Plus Consulting & Yole Développement, April 2018

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  • GaN power device industry: the supply chain is acting to support market growth

    Press Release by System Plus Consulting, April 2018

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  • Teardown: ST grows inside Samsung’s S9

    Article by Junko Yoshida, EETimes, March 2018

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