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Reports

Most recent Reverse
Costing reports

  • Mobileye EyeQ3®

    3rd Generation Mobileye Processor For Vision Based Driver Assistance Systems

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  • MEMS Microphone – Technology and Patent Infringement Risk Analysis

    Market growth, challenged leader : patent battle can start

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  • Huawei Ascend Mate 7 Fingerprint Sensor

    Fingerprint Cards integrates in Huawei’s product the first smartphone fingerprint sensor based on capacitive sensing technology.

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  • Bosch SMI130

    Bosch’s first 6-Axis IMU for Automotive Application Combines 3-Axis Gyroscope and 3-Axis Accelerometer

    Read more
  • CREE 1700V SiC Module

    A specific SiC epitaxy with a dual layers structure for a very low Rdson of 8mΩ

    Read more
See all reports

Tools

Most recent Costing
Tools

  • MEMS Price+

    Costing tool for MEMS

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  • PCB Price+

    Costing tool for printed circuit boards

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  • Power Price+

    Costing tool for active power components & modules

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  • 3D-Package CoSim+

    Package manufacturing cost simulation tool

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  • LED CoSim+

    Read more
See all costing tools

Events

  • PCIM Europe 2015

    May 19-21, 2015 Nuremberg
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    We will be happy to welcome you at PCIM Europe – May 19-21, 2015 Hall: 7 – Booth:…

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  • Next IC Training Session in Munich on May 19, 2015

    TRAINING ICs_Munich_1

      System Plus Consulting offers a training session on Cost Methods of ICs, designed to…

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New articles

  • Newsletter #4

    Newsletter of February 2015 by System Plus Consulting

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  • i-Micronews December 2014

    Article “FLIR ONE: the first consumer thermal imager with a microbolometer” by System Plus Consulting.

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  • Micronews #149

    Article “SORAA: GaN on GaN LED” by System Plus Consulting.

    Read more
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